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Technical
Data
481271850043
"PROGRAM 94"
Free-standing models Range Band C
1.
Dimension
Height
85
cm
Width
59,4
cm
Depth
60
cm
Weight
53
kg
Wrapping
Shrink film
2.
Specification
! PI-Expression
Wafer consumption
19,0
I
Energy consumption
1,5
kW/h
Program step
app. 78
min
Noise level:
Range B
52
dB (A)
Range C
klo 52
dB (A)
Detergent
25-75
ml
Separate contained
chamber
1=113
I1 = 2/3
Salt consumption
by
21 ° dh
max. 30
gram
Hot wafer connection
see type..
60
°C
Capacity
12
standard plaGe settings
3.
Volume
Water
Basic level
1 ,5
I
Working level
2,4
I
Dynamic level
app. 4,6
I
Safety level
9,0
I
Overflow-level
12,5
I
Detergent
max. 75
gram
Clear rinse
130
cm3
6 Dossier steps
1-6
cm3
Salt container
2
kg
4.
Flow Rates !Inlet
Volumes
Spray pump
70
I 1 min
Drain pump
16,5
I 1 min
Wafer inlet
elctrovalve
5,5
I
5.
Water Pressure
Inlet pressure
0,3-10
bar
Spray pump pressure
0,37
bar
6.
Rotations
Spray pump motor
2800
r 1 min
Drain pump motor
2800
r 1 min
Spray arm lower
57 j: 7
r 1 min
Spray arm upper
34 j: 6
r 1 min
-J
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