Printed Wiring Board - Cd Section - Sony CFD-S22 Service Manual

CFD-S22/S32
6-7. PRINTED WIRING BOARD — CD SECTION — • Refer to page 18 for Circuit Boards Location.
1 2 3
A
B
C
D
TP
(RF)
E
F
G
H
I
J
04
4 5 6
– 27 –
7 8 9 10
• Semiconductor
Location
Ref. No.
IC701
IC702
IC703
Q701
Q702
C763
C764
C773
(Page 33)
• Waveforms
1
Location
H-7
2
E-5
B-5
F-8
J-7
3
4
5
Note on Printed Wiring Boards:
• X : parts extracted from the component side.
• b : Pattern from the side which enables seeing.
– 28 –
(MODE: PLAY)
100mV/div 20nsec/div
2.2Vp-p
16.9344MHz
IC702 (XTAO)
yj
100mV/div 2 sec/div
2Vp-p
7.6 sec
IC702 wh (MDP)
50mV/div 500nsec/div
1.2±0.3Vp-p
IC701 qg (RFO)
100mV/div 1 sec/div
2.5V
Approx. 200mVp-p
IC701 qd (FE)
100mV/div 1 sec/div
2.5V
Approx. 100mVp-p
IC701 qa (TE)