Printed Wiring Board - Cd Section (Former Type) - Sony CFD-S26 Service Manual

CFD-S26
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
Common Note on Schematic Diagrams:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1 / W or less unless otherwise
4
specified.
• : internal component.
f
• C : panel designation.
Note: The components identified by mark 0 or dotted line
with mark 0 are critical for safety.
Replace only with part number specified.
• A : B+ Line.
• H : adjustment for repair.
• Total current is measured with no cassette installed.
• Power voltage is dc 9V and fed with regulated dc power
supply from battery terminal.
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: FM
f
: AM
E
: PB
a
: REC
J
: CD
• Abbreviation
AR : Argentina model.
AUS : Australian model.
E4 : AC 110-120V/220-240V area in E model.
E92 : AC 120V area in E model.
MX : Mexican model.
SP : Singapore model.
Common Note on Printed Wiring Boards:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• : internal component.
f
• : Pattern from the side which enables seeing.
• Abbreviation
AR : Argentina model.
AUS : Australian model.
E4 : AC 110-120V/220-240V area in E model.
E92 : AC 120V area in E model.
MX : Mexican model.
SP : Singapore model.
6-5. PRINTED WIRING BOARD — CD SECTION (FORMER TYPE) — • Refer to page 19 for Circuit Boards Location.
1 2 3
A
B
C
D
MAIN
BOARD 1
CNP804
(Page 24)
E
F
G
H
I
J
22
4 5 6
FY
TY
TP
(FE)
TP
(RF)
22
7 8 9
• Semiconductor
Location
Ref. No. Location
IC701 D-5
IC702 I-4
Q701 G-5
FX
TX
TP
(TE)
TP
(VREF)
1-680-943-
10