Technical Specifications - Communications - HP dx2250 Specifications

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Technical Specifications - Communications

Intel PRO/1000 PT PCIe
Gigabit NIC
HP Wireless A+G PCI
Connector
Controller
Memory
Data rates supported
Compliance
Bus architecture
Data transfer mode
Hardware certifications
Power requirement
Boot ROM support
Network transfer rate
Environmental
Dimensions
Management capabilities ASF, WOL, PXE, DMI, WFM 2.0.
Dimensions
Weight
Controller
system interface
Network standard
Frequency band
Operating temperature
Storage temperature
Humidity
Operating voltage
Power consumption
Output power
(approximately)
DA - 12605 Worldwide — Version 19 — March 24, 2008
HP Compaq dx2250 Microtower Business PC
RJ-45
Intel 82572EI Gigabit Ethernet Controller
Integrated Dual 48K configurable transmit receive FIFO Buffers
10/100/1000 Mbps
IEEE 802.1P, 802,1Q, 802.2, 802.3, 802.3AB and 802.3u compliant, 802.3x
flow control
PCI-E 1.0a
Bus-master DMA
FCC, B, CE, TUV- cTUVus Mark Canada and United States, TUV- GS Mark for
European Union
Aux 3.3V, 3.0 Watts in 1000base-T and 2.0 Watts in 100Base-T
Yes
10BASE-T (half-duplex) 10 Mbps
10BASE-T (full-duplex) 20 Mbps
100BASE-TX (half-duplex) 100 Mbps
100BASE-TX (full-duplex) 200 Mbps
1000BASE-T (full-duplex) 2000 Mbps (actual rate limited by PCI Bus)
Operating temperature
Operating humidity
6.4 x 2.6 x 0.8 in (16.3 x 6.6 x 1.9 cm)
4.99 x 2.54 x 0.71 in (126.8 x 64.4 x 18.0 mm)
0.268 lb (65 g)
Atheros AR5414X chipset
PCI Spec 2.2
IEEE 802.11a/b/g
5.1500 to 5.8500 GHz
2.4000 to 2.4835 GHz
2.4465 to 2.4835 GHz (Europe, Middle East, Asia and Asia Pacific – excluding
Japan)
2.4000 to 2.4697 GHz (Japan)
32° to 140° F (0° to 60° C), operating
-4° to 176° F (-20° to 80° C), non-operating
10% to 85% non-condensing
5V ± 5%
Tx/Rx peak 560/250mA @ 3.3V (max.)
15 dBM ±2dB
32° to 131°F (0° to 55° C)
85% at 131° F (55° C)
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