Product Specifications - Foxconn H55MXV User Manual

1-1 Product Specifications

CPU
DMI Bus
Chipset
Memory
Audio
LAN
Expansion Slots
Onboard Serial ATA
USB
Internal Connectors
Back Panel
Connectors
Support LGA 1156 socket Intel ® CPU:
Intel ® Core
i7, Core
TM
Full duplex up to 10Gb/s each direction
Intel ® H55
2 x 240-pin DDR3 DIMM sockets
Support up to 8GB of system memory
Dual channel DDR3 1333/1066MHz architecture
Realtek 6-channel audio chip
High Definition Audio
2/4/5.1-channel
Support for S/PDIF out
Support Jack-Sensing function
Realtek 10/100/1000Mb/s LAN chip
1 x PCI Express x16 slots
1 x PCI Express x1 slots
2 x PCI slot
6 x SATA connectors
300MB/s data transfer rate
Support hot plug and NCQ (Native Command Queuing)
Support hot plug
Supports up to 12 x USB 2.0 ports (6 rear panel ports, 3 onboard USB head-
ers supporting 6 extra ports)
Support USB 2.0 protocol up to 480Mb/s
1 x 24-pin ATX main power connector
1 x 4-pin ATX 12V power connector
1 x CPU fan header (4-pin)
1 x System fan headers (4-pin)
1 x Front Audio connector
1 x SPDIF-OUT connector
1 x Speaker connector
3 x USB 2.0 connectors (supporting 6 x USB devices)
1 x Front Panel connector
6 x SATA connectors
1 x TPM connector
1 x COM connector
1 x INTR connector
1 x CIR connector
1 x PS/2 port
1 x Parallel port
6 x USB 2.0 ports
1 x DVI-D port
1 x VGA port
1 x RJ-45 LAN port
i5 and Core i3 processors
TM TM
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