Table of Contents
Advertisement
Me
Environment
50 HP E1399A Breadboard Specifications
Cooling per Slot:
Humidity:
Operating
Temperature:
Storage Temperature:
Safety EMI/RFI
Safety:
To maintain less then 10C rise on the
breadboard, about 0.08 liter/sec of airflow is
required for each watt dissipated. At a power
dissipation of 20W, the pressure drop across a
typically populated breadboard will be 0.05 mm
H
2O.
65%, 0 - 40 ºC
0 - 55 ºC
-40 ºC to 70 ºC
ets FTZ 1046/1984, CSA 556B, IEC 348, UL
1244
Appendix A
Advertisement
Table of Contents
