Hp E1399A Breadboard Specifications - HP E1399A User Manual

HP E1399A Breadboard Specifications

Mechanical
VXIbus Interface
Power and Cooling
Appendix A
Module Size:
Weight:
Connectors Used:
Number of Slots Used:
User Component
Area:
Grid Hole Spacing:
Grid Hole Inside
Diameter:
Max Component
Height:
Maximum Lead
Length:
Device Type:
VXIbus Interface
Capability:
Interrupt Level:
Maximum Power
Dissipation:
Power Requirements:
Watts per Slot:
B
0.7 Kg
P1
1
222 mm X 96 cm (8.75 in X 3.78 in)
2.54 mm X 2.54 mm (0.1 in X 0.1 in)
1.17 mm (0.046 in)
12.7 mm (0.5 in) above board
1.3 mm (0.05 in) below board
Register Based
Slave, Interrupter, A16, D16
1-7, selectable
Determined by mainframe cooling. Cannot
exceed the number of watts (per module) per slot
total cooling (backplane interface circuitry
consumes 0.5 watts).
Voltage = +5 Vdc
Peak Module Current, IPM (A) = 0.10
Dynamic Module Current, IDM (A) = 0.01
0.5 (backplane interface circuitry only. User
circuitry not included).
HP E1399A Breadboard Specifications 49
Appendix A