KX-F1200
i
HOW TO REPLACE FLAT PACKAGE IC
•
PREPARATION
• SOLDER .....................................
Sparkle Solder 115A-1, 115B-1
OR
Almit Solder KR-19, KR-19RMA
• PROCEDURE
• Soldering iron ..............................
Recommended
power consumption
will be between 30 W to
40 W.
Temperature of Copper Rod 662 ___50°F(350 ___ 10 °C)
(An expert may handle 60-80 W iron, but a beginner might
damage the foil by overheating.)
• Flux .............................................
HI115
Specific gravity 0.863
(Original flux will be replaced daily.)
1. Temporarily fix the FLAT PACKAGE IC by Soldering on two marked pins.
• .................. Temporary soldering point.
*Accurate setting of the IC to the corresponding soldering foil is vital.
2. Apply flux to the all pins of the FLAT PACKAGE IC.
.......... Flux
3. Solder the specified solder in the direction of the arrow, while slide the soldering iron.
O
iron
Specified solder
• MODIFICATION
PROCEDURE
OF BRIDGE
1. Re-solder slightly on bridged portion.
2. Remove any remaining solder along the pins using soldering iron as shown below.
j
bridge
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