HP DL370 - ProLiant - G6 Performance Introduction Manual
Technology and architecture of hp proliant intel-based 300-series g6 (generation 6) servers
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User Manual
Technology and architecture of HP ProLiant Intel-
based 300-series G6 (Generation 6) servers
Technology brief
Abstract.............................................................................................................................................. 3
Introduction......................................................................................................................................... 3
Intel Xeon 5500 Series processor technology .......................................................................................... 3
Multi-level caches ............................................................................................................................. 3
Integrated memory controller ............................................................................................................. 4
QuickPath Interconnect controller ....................................................................................................... 4
Hyper Threading.............................................................................................................................. 5
Turbo Boost technology..................................................................................................................... 6
Memory.............................................................................................................................................. 6
DDR-3............................................................................................................................................. 6
I/O technologies ................................................................................................................................. 9
PCI Express technology..................................................................................................................... 9
HP Smart Array and SAS/SATA technology ...................................................................................... 10
Networking technologies ................................................................................................................ 12
Power and thermal technologies .......................................................................................................... 13
Efficient power delivery................................................................................................................... 13
Improved thermal sensors and fan control ......................................................................................... 14
Dynamic Power Capping ................................................................................................................ 15
Phase shedding ............................................................................................................................. 16
Managing processor technologies.................................................................................................... 17
Managing memory technologies ...................................................................................................... 17
DIMM Choices ............................................................................................................................. 7
Memory Mirroring with DDR3 ........................................................................................................ 8
Memory channel interleaving......................................................................................................... 9
SAS-2 ....................................................................................................................................... 10
New generation HP Smart Array controllers .................................................................................. 11
Battery backed write cache ......................................................................................................... 11
Zero Memory RAID..................................................................................................................... 11
Smart Array Advanced Pack (SAAP) ............................................................................................. 11
Software RAID ........................................................................................................................... 12
Common slot power supplies ....................................................................................................... 13
Increasing power efficiency in redundant power operation.............................................................. 14
Voltage regulation ...................................................................................................................... 14
Phase shedding based on the installed processor ........................................................................... 16
Memory phase shedding............................................................................................................. 16
Dynamic CPU phase shedding ..................................................................................................... 17
QuickPath Interconnect power...................................................................................................... 17
Disabling processor cores............................................................................................................ 17
Minimum processor idle power state............................................................................................. 17
Memory channel interleaving....................................................................................................... 17
Maximum memory data rates....................................................................................................... 17
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Summary of Contents for HP DL370 - ProLiant - G6 Performance
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Page 1: Table Of Contents
Technology and architecture of HP ProLiant Intel- based 300–series G6 (Generation 6) servers Technology brief Abstract.............................. 3 Introduction............................3 Intel Xeon 5500 Series processor technology ..................3 Multi-level caches ..........................3 Integrated memory controller ......................4 QuickPath Interconnect controller ....................... 4 Hyper Threading.......................... - Page 2 Managing I/O technologies......................18 Disable PCIe 2.0 ........................18 I/O Power Provisioning....................... 18 Power profiles..........................18 Power Performance Benchmarks ......................18 Security ............................19 Trusted Platform Module........................19 BitLocker Drive Encryption ....................... 19 Systems management and monitoring ....................19 HP Insight Control Environment ......................20 HP Insight Dynamics –...
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Page 3: Abstract
Abstract This technology brief describes the key technologies implemented in Intel-based HP ProLiant 300-series G6 servers. Introduction HP ProLiant 300-series G6 servers have been the focus of extensive engineering and development. Characterized by increased performance, better power efficiency, and more powerful management tools, the servers include these new technologies: •... -
Page 4: Integrated Memory Controller
three-level cache hierarchy for Figure 1. Block diagram of Intel Xeon 5500 Series processors The Level 3 cache is shared and inclusive, which means that it duplicates the data stored in the Level 1 and Level 2 caches of each core. This guarantees that data is stored outside the cores and minimizes latency by eliminating unnecessary core snoops to the Level 1 and Level 2 caches. -
Page 5: Hyper Threading
Each link is comprised of twenty 1-bit lanes. A maximum of 16 bits are used to transfer data; the remaining 4 bits are used for the protocol and error correction. The interconnect performs a maximum of 6.4 gigatransfers per second and has a bandwidth of 12.8-gigabytes per second in each direction, for a total bandwidth of 25.6 gigabytes per second. -
Page 6: Turbo Boost Technology
Figure 3. Diagram representing SMT technology in the 5500 Series processor Incorporating simultaneous multithreading improves performance at a proportionately small additional power cost, improving performance per watt (W), and allowing ProLiant G6 servers to do more using the same—or less—power as previous-generation, Intel processor-based servers. Turbo Boost technology Intel’s Turbo Boost technology complements Simultaneous Multi-threading Technology by increasing the performance of both multi-threaded and single-threaded workloads. -
Page 7: Dimm Choices
1333 Megatransfers per second (MT/s). While this is commonly referred to as having a speed of 1333 MHz, the maximum clock speed for the DIMMs is actually 667 MHz and the signal is double- pumped to achieve the data rate of 1333 MT/s. DDR3-1333 DIMMs can operate at clock speeds of 667 MHz, 533 MHz and 400 MHz;... -
Page 8: Memory Mirroring With Ddr3
Processor SKU determines the ability of ProLiant G6 servers to run DDR-3 memory at a top speed of 1333 MT/s. The processor SKU also dictates the range of speeds possible in different DIMM per channel (DPC) configurations. DIMM operating speeds are also subject to memory slot configuration and whether the server in question has 12 or 18 slots. -
Page 9: Memory Channel Interleaving
Memory channel interleaving The Xeon 5500 Series processor retrieves data from the memory DIMMs in 64-byte chunks. With channel interleaving, the system is set up so that each consecutive 64-byte chunk in the memory map is physically transferred by means of alternate routing through the three available data channels. The result is that when the memory controller needs to access a block of physically contiguous memory, the requests are distributed more evenly across the three channels rather than potentially stacking up in the request queue of a single channel. -
Page 10: Hp Smart Array And Sas/Sata Technology
Table 2. PCIe device interoperability PCIe x4 Connector x8 Connector x8 Connector x16 Connector x16 Connector device type x4 Link x4 Link x8 Link x8 Link x16 Link x4 card x4 operation x4 operation x4 operation x4 operation x4 operation x8 card Not allowed x4 operation... -
Page 11: New Generation Hp Smart Array Controllers
Beginning with HP product releases in the first quarter of 2009, Smart Array controllers are SAS-2 capable. In fully supported controllers, 6-Gb/s SAS technology allows Smart Array controllers to deliver peak data bandwidth up to 600 megabytes per second (MB/s) per physical link in each direction. -
Page 12: Software Raid
SAAP requires a license key for activation. After activation, administrators can use several standard capabilities: • RAID 6 with Advanced Data Guarding (ADG) protects against failure of any two drives. It requires a minimum of four drives, but only two would be available. •... -
Page 13: Power And Thermal Technologies
Power and thermal technologies HP engineers have developed a robust set of power and thermal technologies, and components to manage power within the ProLiant 300-series G6 servers. The following technologies improve power efficiency throughout the power delivery chain: • Efficient power delivery •... -
Page 14: Increasing Power Efficiency In Redundant Power Operation
Figure 5. Power/Efficiency curve for the 750 W HP power supply Output Power (Watts) Represents 92% power efficiency Represents 92% power efficiency Through the introduction of these different wattage power supplies, HP allows users to choose a power supply that meets, but does not exceed their needs. Oversized and lightly loaded power supplies do not run as efficiently as those that are highly loaded. -
Page 15: Dynamic Power Capping
The previous generation of ProLiant servers marked a shift away from processors as the primary producers of heat in the server. As memory modules become denser, they generate more heat. To combat this, DDR-3 DIMMs, as used in the ProLiant G6 servers, incorporate the first reliable on-DIMM thermal sensors Because hard drive thermal sensors were not directly associated with fans, the fans would often operate at high speeds to prevent hard drives from overheating. -
Page 16: Phase Shedding
Figure 6. Rapid response of Dynamic Power Capping avoids circuit breaker trips Phase shedding HP incorporated intelligent phase shedding into ProLiant G6 voltage regulators. Modern digital voltage regulators deliver DC power using up to five different phases of high-speed power pulses that charge capacitors to deliver straight DC power to components at the proper voltage. -
Page 17: Dynamic Cpu Phase Shedding
Dynamic CPU phase shedding On entry into a low power state (less than 20 W), the Intel Xeon 5500 Series processors will activate the Power Status Indicator (PSI). When PSI is engaged, ProLiant G6 servers turn off voltage regulator phases, thereby saving power and increasing power efficiency. Managing processor technologies QuickPath Interconnect power The Xeon 5500 Series processor will allow the QuickPath Interconnect (QPI) buffers to enter a sleep... -
Page 18: Managing I/O Technologies
save power, but may incur some performance penalty. Administrators can configure the maximum memory data rate through the RBSU. Managing I/O technologies Disable PCIe 2.0 A ProLiant G6 option allows all expansion slots to run at PCIe 1.0 rather than PCIe 2.0 speed. Enabling this option saves power and provides backward compatibility with cards that may not correctly operate in PCIe 2.0 slots. -
Page 19: Security
Visit the SPEC website for ProLiant DL380 G6 test results: http://www.spec.org/power_ssj2008/results/res2009q2/power_ssj2008-20090325-00136.html Security The Trusted Platform Module™ (TPM) and Microsoft® BitLocker® technology are supported in all ProLiant 300-series G6 servers by means of the available Trusted Platform Module option kit. Trusted Platform Module The Trusted Platform Module v1.2 supported on ProLiant G6 servers is a microcontroller chip that can create, securely store, and manage artifacts such as passwords, certificates, and encryption keys that are used to authenticate the server platform. -
Page 20: Hp Insight Control Environment
HP Insight Control Environment HP Insight Control Environment (ICE) management suite is the infrastructure management suite that HP recommends for every HP G6 server. ICE provides infrastructure management functions, including a complete set of lifecycle management tools. HP Insight Dynamics – VSE HP Insight Dynamics –... -
Page 21: For More Information
For more information For additional information, refer to the resources listed below. Resource description Web address http://h18004.www1.hp.com/products/servers/options/tool/ DDR3 Memory Configuration Tool hp_memtool.html http://h71028.www7.hp.com/ERC/downloads/4AA2- Dynamic Power Capping TCO and Best Practices White Paper 3107ENW.pdf www.hp.com/go/ice HP Insight Control Environment http://media.hpvitc.veplatform.com/content/HP_Network_Ada HP Network Adapters for ProLiant DL and ML Servers pters_for_ProLiant_DL_Family_data_sheet_1237839147.pdf HP Insight Management WBEM... -
Page 22: Call To Action
Call to action Send comments about this paper to TechCom@HP.com © 2009 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services.