Localized High Temperature Zones; Thermal Considerations For Components - Intel BLKDG965RYCK Technical Product Specification

Intel Desktop Board DG965RY Technical Product Specification
Figure 23 shows the locations of the localized high temperature zones.
Table 33 provides maximum case temperatures for the board components that are
sensitive to thermal changes. The operating temperature, current load, or operating
frequency could affect case temperatures. Maximum case temperatures are important
when considering proper airflow to cool the board.
Table 33. Thermal Considerations for Components
Component
Processor
Intel 82G965 GMCH
Intel 82801HB ICH8
For information about
Processor datasheets and specification updates
64
Item Description
A Processor voltage regulator area
B Processor
C Intel 82G965 GMCH
D Intel 82801HB ICH8
Figure 23. Localized High Temperature Zones
Maximum Case Temperature
For processor case temperature, see processor datasheets and
processor specification updates
97 o C (under bias)
92 o C (under bias)
Refer to
Section 1.2, page 15