Table of Contents
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5.1 Regulatory Compliance..................................................................... 81
5.1.1
Safety Regulations................................................................ 81
5.1.2
European Union Declaration of Conformity Statement ................ 82
5.1.3
Product Ecology Statements................................................... 84
5.1.4
EMC Regulations .................................................................. 87
5.1.5
Product Certification Markings (Board Level)............................. 88
5.2 Battery Disposal Information............................................................. 89
Figures
1.
Major Board Components.................................................................. 12
2.
Block Diagram ................................................................................ 14
3.
Memory Channel Configuration and DIMM Configuration........................ 18
4.
Dual Channel (Interleaved) Mode Configuration with Two DIMMs............ 19
5.
6.
7.
8.
9.
Flex Mode Configuration with Two DIMMs............................................ 22
10. Front/Back Panel Audio Connector Options .......................................... 29
11. LAN Connector LED Locations ............................................................ 31
12. Thermal Sensors and Fan Headers ..................................................... 33
13. Location of the Standby Power Indicator LED ....................................... 40
14. Detailed System Memory Address Map ............................................... 42
15. Back Panel Connectors ..................................................................... 49
16. Component-side Connectors and Headers ........................................... 50
17. Connection Diagram for Front Panel Header ........................................ 55
18. Connection Diagram for Front Panel USB Headers ................................ 57
19. Connection Diagram for IEEE 1394a Header ........................................ 57
20. Location of the Jumper Block............................................................. 58
21. Board Dimensions ........................................................................... 59
22. I/O Shield Dimensions...................................................................... 60
23. Localized High Temperature Zones..................................................... 64
Tables
1.
Feature Summary............................................................................ 10
2.
Manufacturing Options ..................................................................... 11
3.
Board Components Shown in Figure 1 ................................................ 13
4.
Supported Memory Configurations ..................................................... 16
5.
Memory Operating Frequencies ......................................................... 17
6.
DVI Port Status Conditions................................................................ 25
7.
Audio Jack Retasking Support ........................................................... 28
8.
LAN Connector LED States ................................................................ 31
9.
Effects of Pressing the Power Switch .................................................. 34
10. Power States and Targeted System Power........................................... 35
Contents
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