Mechanical Specifications; Boxed Processor Heat Sink Dimensions (Cek); Thermal Solution (Exploded View) - Intel E5410 - Cpu Xeon Quad Core 2.33Ghz Fsb1333Mhz 12M Lga771 Tray Datasheet

Boxed Processor Specifications
Figure 8-3. 2U Passive Quad-Core Intel® Xeon® Processor 5400 Series

Thermal Solution (Exploded View)

Notes:
1. The heat sinks represented in these images are for reference only, and may not represent the final boxed
processor heat sinks.
2. The screws, springs, and standoffs will be captive to the heat sink. This image shows all of the components
in an exploded view.
3. It is intended that the CEK spring will ship with the base board and be pre-attached prior to shipping.
8.2

Mechanical Specifications

This section documents the mechanical specifications of the boxed processor.
8.2.1

Boxed Processor Heat Sink Dimensions (CEK)

The boxed processor will be shipped with an unattached thermal solution. Clearance is
required around the thermal solution to ensure unimpeded airflow for proper cooling.
The physical space requirements and dimensions for the boxed processor and
assembled heat sink are shown in
Figure 8-10
connector used for the active CEK fan heat sink solution.
Figure 8-4
are the mechanical drawings for the 4-pin board fan header and 4-pin
through Figure 8-8. Figure 8-9 through
105