Table Of Contents - Sony CFD-S03CP Service Manual

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UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

TABLE OF CONTENTS

1.
2.
................................................................... 5
3.
3-1. Cabinet (Rear) Assy ......................................................... 7
3-3. Main Board ...................................................................... 8
3-4. CD Block Assy ................................................................ 8
3-5. BD83S Board .................................................................. 9
3-6. Optical Pick-up ................................................................ 9
3-7. Panel Board ..................................................................... 10
3-8. CD Lid ............................................................................. 10
3-10. TC Board ......................................................................... 11
3-11. Key-1 Board, Key-2 Board .............................................. 12
3-12. Power Board .................................................................... 12
4.
5.
Tape Section .................................................................... 13
Tuner Section ................................................................... 14
CD Section ...................................................................... 16
6.
6-1. Block Diagram - CD Section - ....................................... 17
6-2. Block Diagram - Main Section - .................................... 18
6-3. Circuit Boards Location .................................................. 19
6-4. Printed Wiring Board - BD83S Section - ....................... 20
6-5. Schematic Diagram - BD83S Section - .......................... 21
6-6. Printed Wiring Board - Main Section - .......................... 22
6-10. Printed Wiring Boards - TC Section - ............................ 26
6-11. Schematic Diagram - TC Section - ................................ 27
6-12. Printed Wiring Boards - Panel Section - ........................ 28
6-13. Schematic Diagram - Panel Section - ............................ 29
7.
7-1. Rear Cabinet Section ....................................................... 39
7-2. Front Cabinet Section (1) ................................................ 40
7-3. Front Cabinet Section (2) ................................................ 41
7-4. Upper Cabinet Section (1) ............................................... 42
7-5. Upper Cabinet Section (2) ............................................... 43
7-6. CD Mechanism Section ................................................... 44
8.
CFD-S03CP/S03CPL
................................................ 4
......................... 13
.................................. 45
3

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