Circuit Boards Location - Sony CFD-S03CP Service Manual

6-3. CIRCUIT BOARDS LOCATION

HEADPHONE board
KEY-1 board
PANEL board
TC board
• Waveforms
— BD83S Board — (CD PLAY)
1 3
IC201 1 (LRCK)
3.2 Vp-p
22.6 µ sec
1 V/div, 10 µ sec/div 1 V/div, 5 msec/div
2 4
IC201 5 (BCK)
3.2 Vp-p
0.47 µ sec
1 V/div, 200 nsec/div 100 mV/div, 5 msec/div
— MAIN Board —
1 2
IC1 w; (X OUT)
2.2 Vp-p
75 kHz
1 V/div, 5 µ sec/div 1 V/div, 100 nsec/div
CFD-S03CP/S03CPL
POWER board
BD83S board
BATTERY-1 board
MAIN board
KEY-2 board
BATTERY-2 board
5
IC201 td (TEO) IC201 u; (RFACO)
1.7 V
Approx. 1 Vp-p
500 mV/div, 0.5 µ sec/div
6
IC201 tg (FEO) IC201 <z/, (XTAO)
1.7 V
Approx. 150 mVp-p
16.95 MHz
1 V/div, 20 nsec/div
— TC Board — (REC)
1
IC801 os (X1) Q301 C
3.4 Vp-p
4.13 MHz (AM)
4.17 MHz (EXCEPT AM)
1 V/div, 10 µ sec/div
• NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For schematic diagrams.
Note:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
specified.
• f : internal component.
• C : panel designation.
Note:
The components identi-
fied by mark 0 or dotted
line with mark 0 are criti-
cal for safety.
Replace only with part
number specified.
• A : B+ Line.
• H : adjustment for repair.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
– BD83S Board –
no mark : CD PLAY
– MAIN (1/3) Board –
no mark : FM
( ) : AM
– MAIN (2/3), (3/3) and Other Boards –
no mark : FM
( ) : PB
< > : REC
[ ] : CD PLAY
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
+0.3
1.1 Vp-p
–0.2
• Circled numbers refer to waveforms.
• Signal path.
F : FM
f : AM
E : PB
a
: REC
J
: CD PLAY
• Abbreviation
CND : Canadian model.
CET : East European & Russian model.
E41 : AC 230V area in E model.
E92 : AC 120V area in E model.
3.3 Vp-p
AUS : Australian model.
KR : Korea model
MX : Mexican model.
SP : Singapore model.
IT : Italian model.
AR : Argentina model.
TH : Thai model.
TW : Taiwan model.
2
HRP301 (YEL)
3.5 Vp-p 35 Vp-p
18.2 µ sec 18.2 µ sec
10 V/div, 10 µ sec/div
19 19
For printed wiring boards.
Note:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• W : indicates side identified with part number.
1 / W or less unless otherwise • : internal component.
f
4
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Note:
Pattern face side: Parts on the pattern face side seen from
Les composants identifiés par
(Conductor Side) the pattern face are indicated.
une marque 0 sont critiques
Parts face side: Parts on the parts face side seen from
pour la sécurité.
(Component Side) the parts face are indicated.
Ne les remplacer que par une
piéce portant le numéro
C
spécifié.
Q These are omitted.
B E
Q
B C E
These are omitted.
Q
B C E
• Abbreviation
CND : Canadian model.
CET : East European & Russian model.
E41 : AC 230V area in E model.
E92 : AC 120V area in E model.
AUS : Australian model.
KR : Korea model
MX : Mexican model.
SP : Singapore model.
IT : Italian model.
AR : Argentina model.
TH : Thai model.
TW : Taiwan model.
CFD-S03CP/S03CPL
Ver. 1.2