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Nomenclature, Package Symbolization, and Revision Identification
5 Nomenclature, Package Symbolization, and Revision Identification
The revision of the device can be identified by the revision letter on the
located inside the TLV structure of the device.
5.1 Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all MSP
MCU devices. Each MSP MCU commercial family member has one of two prefixes: MSP or XMS. These
prefixes represent evolutionary stages of product development from engineering prototypes (XMS) through fully
qualified production devices (MSP).
XMS – Experimental device that is not necessarily representative of the final device's electrical specifications
MSP – Fully qualified production device
Support tool naming prefixes:
X: Development-support product that has not yet completed Texas Instruments internal qualification testing.
null: Fully-qualified development-support product.
XMS devices and X development-support tools are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."
MSP devices have been characterized fully, and the quality and reliability of the device have been demonstrated
fully. TI's standard warranty applies.
Predictions show that prototype devices (XMS) have a greater failure rate than the standard production devices.
TI recommends that these devices not be used in any production system because their expected end-use failure
rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the temperature
range, package type, and distribution format.
5.2 Package Markings
ZQW113
BGA (ZQW), 113 Pin
PZ100
LQFP (PZ) 100 Pin
4
MSP430FG6625 Microcontroller
Copyright © 2021 Texas Instruments Incorporated
Package Markings
or by the
SLAZ668P – MAY 2015 – REVISED AUGUST 2021
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