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System Specifications
Model
Form Factor
Dimensions
Processor
Chipset
Memory
Internal
Storage
Drive Bays
Expansion
Slots
Security
Server
Management
Cooling
Environmental
Certifications
S2205-04
17.2"W (438mm) x 3.4"H (87mm) x 30.3"D (770mm)
∙ 2 x Intel® Xeon® Processor Scalable Family (Socket-E)
- Sapphire Rapids (SPR)/ Emerald Rapids (EMR)
Intel® C741
∙ 32 x DDR5 RDIMM/ RDIMM-3DS, w/ ECC
- SPR: 4800MTs (1DPC)/ 4400MTs (2DPC)
- EMR: 5600MTs (1DPC)/ 4800MTs (2DPC)
- 8 x Channels DDR5 per CPU/ 2DPC 16 DIMMs per socket
∙ 2 x M.2 M-key (22110/ 2280)
∙ 1 x MicroSD (internal)
∙ 24 x 2.5" Hybrid hot-swap drive bay
- 24x NVMe or 16x NVMe + 8x SATA
∙ 4 x 2.5" SATA Hot-swap drive bays (external rear)
∙ 4 x PCIe slots
- Riser1: 1 x FH Gen 4 (x16/0/0)
- Riser2: 3 x FH Gen 4 (x8/x16/x8)
∙ 1 x OCP 3.0 Mezzanine card slot
∙ TPM 2.0
∙ Case intrusion switch
∙ Aspeed AST2600 IPMI 2.0 with iKVM support
∙ 1 x GbE RJ45 (1x Mgmt.)
∙ 2 x CPU EVAC with air duct @350W
∙ 2 x Passive CPU heatsink with air duct @250W (Optional)
∙ System Operating Temperature: 0°C ~ 35°C
∙ Non-operating Temperature: -20°C ~ 70°C
∙ Non-operating Relative Humidity: 5% ~ 85% (non-condensing)
CE, FCC (Class A)
2U
System Specifications
7
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