Table Of Contents - Sony CDP-XE530 Service Manual

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The following caution label is located inside of the unit.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH
MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
This appliance is classified
as a CLASS 1 LASER
product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
- 2 -

TABLE OF CONTENTS

............................................................ 3
............................................................................ 6
3-1. Front Panel ......................................................................... 7
3-2. Base Unit (BU-5BD25) ...................................................... 7
........................................................................ 8
6-1. Circuit Boards Location ................................................... 12
6-4. Printed Wiring Board - BD Section - .............................. 15
6-5. Schematic Diagram - BD Section - ................................. 17
6-6. Printed Wiring Board - Main Section - ........................... 19
6-7. Schematic Diagram - Main Section - .............................. 21
6-8. Printed Wiring Board - Display Section - ....................... 23
6-9. Schematic Diagram - Display Section - .......................... 25
6-10. IC Pin Functions ............................................................... 27
6-11. IC Block Diagrams ........................................................... 31
7. EXPLODED VIEWS
7-1. Main Section ..................................................................... 34
7-3. Base Unit Section (BU-5BD25) ....................................... 36
MODEL IDENTIFICATION
- BACK PANEL -
PARTS No.
XE530 : AEP, North European, CIS
4-214-172-0π
4-214-172-1π
XE530 : UK
......................... 10
......................................... 37
Parts No.
MODEL

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