Thermal Restriction Matrix - Dell VxRail VP-760 Manual

Particulate Specifications
contamination
Air filtration
Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.
This condition applies to data center environments only.
Air filtration requirements do not apply to IT equipment designed to be used outside a data center in
environments such as an office or factory floor.
Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust
Air must be free of conductive dust, zinc whiskers, or other conductive particles
This condition applies to data center and non-data center environments.
Corrosive dust ● Air must be free of corrosive dust.
● Residual dust present in the air must have a deliquescent point less than 60% relative humidity .
This condition applies to data center and non-data center environments.
Walk-Up Edge Data
Filtration is not required for cabinets that are opened six times or less per year. Class 8 per ISO 1466-1
Center or Cabinet
filtration as defined above is required otherwise.
(sealed, closed loop
In environments commonly above ISA-71 Class G1 or that may have known challenges, special filters may
environment)
be required.
Gaseous contamination
Copper coupon corrosion rate
Silver coupon corrosion rate

Thermal restriction matrix

The information provided describes the thermal restrictions for the VxRail VP-760.
Label reference:
Label
STD
HPR (Silver)
HPR (Gold)
HSK
LP
FH
The following table lists the processor and heat sink matrix:
Heat sink
STD HSK
2U HPR HSK
L-type HSK
All GPU/FGPA cards require 1U L-type HSK and GPU shroud.
The ambient temperature of the configuration is determined by the critical component in that configuration. For example, if the
processor supports an ambient temperature of 35°C (95°F), the DIMM is 35°C (95°F), and the GPU is 30°C (86°F), the
combined configuration can only support 30°C (86°F).
The following table shows the thermal restriction matrix for air cooled configuration (2.5-inch fans):
Specifications
<300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
<200 Å/month as defined by ANSI/ISA71.04-2013
Description
Standard
High Performance Silver (HPR) fan
High Performance Gold (VHP) fan
Heat sink
Low profile
Full height
Processor TDP
≤ 165 W (supports only 2.5-inch drives and non-GPU configuration).
125 W–250 W (supports 3.5-inch drives and non-GPU configuration).
165 W–350 W (supports 2.5-inch drives and non-GPU configuration).
Supports all GPU and FPGA configurations
Technical specifications 25