Panasonic DMR-ES15EB Service Manual page 4

1. Immediately before handling any semiconductor component or semiconductor-equipped
assembly, drain off any ESD on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit
under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a
conductive surface such as aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified
as "anti-static (ESD protected)" can generate electrical charge sufficient to damage ES
devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to
damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately
before you are ready to install it. (Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES
device, touch the protective material to the chassis or circuit assembly into which the
device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety
precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise
hamless motion such as the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity sufficient to damage an ES
device).
2.2. Precaution of Laser Diode
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