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HP Sangoma 2 Disassembly Instructions page 2

Port fxo2 port fxs voice card

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Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Slotted Screw Driver
Phillips Screw Driver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Remove the 12V power cable. Refer to Pic.1
2. Remove the fax sync cable. Refer to Pic 2
3. Snap off the 2 rivets attaching the insulator pad. Using slotted screw driver, remove the nylon screw attaching the
insulator pad to the PCA. Refer to Pic.3
4. Remove the insulator pad
5. Using the slotted screw driver, remove the 3 stand-offs that connects the 2 main PCAs
6. Remove the low profile bracket by removing the 2 screws securing the bracket onto the PCA. Remove the screws
using Phillips screw driver.
7. Remove the 2 small PCAs (1 green and 1 red) from 1 of the main PCA
8.
Using Phillips screw driver, unscrew the 2 screws which attached the smallest PCA to the PCA which does not has
any RJ ports.
9.
10.
11.
12.
13.
14.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Pic
Illustration
1
EL-MF877-00
Template Revision A
0
Tool Size (if
applicable)
Page 2

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This manual is also suitable for:

J9518a