Flat Package Ic Removal Procedure - Panasonic KX-FHD332C Service Manual

8.2.1. PREPARATION
- SOLDER
Sparkle Solder 115A-1, 115B-1 OR Almit Solder KR-19, KR-19RMA
- Soldering iron
Recommended power consumption is between 30 W to 40 W.
Temperature of Copper Rod 662 ± 50°F (350 ± 10°C)
(An expert may handle a 60~80 W iron, but a beginner might
damage the foil by overheating.)
- Flux
HI115 Specific gravity 0.863
(Original flux should be replaced daily.)

8.2.2. FLAT PACKAGE IC REMOVAL PROCEDURE

1. Put plenty of solder on the IC pins so that the pins can be
completely covered.
Note:
If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the
pins with a cutter.
2. Make a few cuts into the joint (between the IC and its pins) first
and then cut off the pins thoroughly.
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