CONTENTS
DIMENSION ..............................................................................10
DISASSEMBLY ..........................................................................11
1. HOUSING FRONT ................................................................12
2. AMP ASSY ...........................................................................13
TROUBLE SHOOTING ................................................................23
BLOCK DIAGRAM .....................................................................27
WIRING DIAGRAM ....................................................................28
SCH01-AIOS Lego ....................................................................30
SCH03-CTIA_QMTP .................................................................32
SCH04-MCU .............................................................................33
SCH05-MISC ............................................................................34
SCH06-POWER ........................................................................35
SCH09-Woofer AMP ................................................................38
EXPLODED VIEW ......................................................................41
PACKING VIEW .........................................................................44
SEMICONDUCTORS ..................................................................45
1. IC's ......................................................................................45
2