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Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur
such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
TABLE OF CONTENTS
1.
2.
................................................................... 6
3.
3-1. Cover (Top) ........................................................... 9
3-2. CD Door ................................................................ 9
3-3. Front Panel Section ............................................... 10
3-4. CD Mechanism Deck (CDM74-K6BD80) ............ 10
3-5. Tape Mechanism Deck, GAME JACK Board ....... 11
3-6. PANEL Board ........................................................ 11
3-7. Back Panel Section, SUB-TRANS Board ............. 12
3-8. Power Transformer ................................................ 12
3-9. MAIN Board ......................................................... 13
3-10. AMP Board ........................................................... 13
3-11. BD80A Board ........................................................ 14
3-12. CONNECT Board ................................................. 14
3-13. DRIVER Board, SW Board .................................. 15
3-14. Optical PICK-UP (KSM-213DCP/Z-NP) ............. 15
3-15. SENSOR Board ..................................................... 16
3-16. MOTOR (TB) Board ............................................. 16
3-17. MOTOR (LD) Board ............................................. 17
4.
............................................................... 18
5.
5-1. Block Diagram - PANEL Section - ...................... 22
5-2. Block Diagrams - MAIN Section - ...................... 23
5-3. Block Diagrams - BD/DRIVER Section - ........... 24
5-4. Printed Wiring Board - BD80A Section - ............ 25
5-5. Schematic Diagram - BD80A Section - ............... 26
- CD MECHANISM Section - ............................. 27
- CD MECHANISM Section - ............................. 28
5-8. Printed Wiring Board - MAIN Section - .............. 29
5-9. Schematic Diagram - MAIN Section (1/2) - ........ 30
5-10. Schematic Diagram - MAIN Section (2/2) - ........ 31
- PANEL COMB Section - ................................... 32
- PANEL COMB Section - ................................... 33
5-13. Printed Wiring Board - PANEL Section - ............ 34
5-14. Schematic - PANEL Section (1/2) - ..................... 35
5-15. Schematic - PANEL Section (2/2) - ..................... 36
5-16. Printed Wiring Board - TRANS Section - ........... 37
5-17. Printed Wiring Board - AMP Section - ................ 38
5-19. IC Pin Function Description .................................. 42
6.
6-1. MAIN Section ....................................................... 48
6-2. Front Panel Section ............................................... 49
6-3. MAIN Board Section ............................................ 50
(CDM74-K6BD80) ............................................... 51
(CDM74-K6BD80) ............................................... 52
7.
HCD-RG121
............................................... 4
.................................. 53
3
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