Temperature And Humidity; Cleanness; Cooling System - HP MSR 2000 Preparing For Installation

Temperature and humidity

You must maintain a proper temperature and humidity in the equipment room.
Lasting high relative humidity tends to cause poor insulation, electricity creepage, mechanical

property change of materials, and corrosion of metal parts.
Lasting low relative humidity is likely to result in loose screws due to washer contraction, and even

ESD, which causes the circuits to fail.
A high temperature is the most undesirable condition, because it accelerates the aging of insulation

materials and significantly lowers reliability and service life of the router.
For the temperature and humidity requirements of the MSR4000 router, see
Table 1 Temperature and humidity requirements
Temperature
0°C to 45°C (32°F to 113°F)

Cleanness

Dust buildup on the chassis might result in electrostatic adsorption, which causes poor contact of metal
components and contact points, especially when indoor relative humidity is low. In the worst case,
electrostatic adsorption can cause communication failure.
Table 2 Dust concentration limit in the equipment room
Substance
Dust particles
NOTE:
Dust particle diameter ≥ 5 μm
The equipment room must also meet strict limits on salts, acids, and sulfides to eliminate corrosion and
premature aging of components, as shown in
Table 3 Harmful gas limits in the equipment room
Gas
SO
2
H S
2
NH
3
Cl
2

Cooling system

The MSR4000 router adopts left to rear airflow for heat dissipation.
Humidity
5% to 90% (noncondensing)
Concentration limit (particles/m
≤ 3 x 10 4
(No visible dust on desk in three days)
Table 3.
Max. (mg/m 3 )
0.2
0.006
0.05
0.01
2
Table 1.
3 )