Processors; Figure 2-8. Processor Assembly - HP Deskpro EX Technical Reference Manual

Chapter 2 System Overview

2.4.1 PROCESSORS

The Compaq Deskpro EX series includes models based on Celeron and Pentium III processors.
These processors are backward-compatible with software written for the Pentium II, Pentium
MMX, Pentium Pro, Pentium, and x86 microprocessors. Both processor architectures include a
floating-point unit, first and secondary caches, and enhanced performance for multimedia
applications through the use of multimedia extension (MMX) instructions.
These systems employ a PGA370 zero-insertion-force (ZIF) socket designed for mounting a "Flip-
Chip" (FC-PGA370) processor package (Figure 2-8).
Lock/Unlock
(Shown in unlock position)
Figure 2–8. Processor Assembly And Mounting
The PGA370 socket allows easy changing/upgrading of the processor. Raising the Lock/Unlock
handle of the socket in the vertical position allows the processor package to be removed or inserted
into the socket. Lowering the Lock/Unlock handle in the down (horizontal) position locks the
processor package in place. These systems support processors fitted with passive heat sink or
processor fitted with a heat sink/fan assembly with a power cable that attaches to a fan-power
header provided on the system board. The processor clock frequency as well as the core voltage is
automatically set by chipset logic, eliminating the need for setting DIP switches when upgrading
the processor.
NOTE: These systems support processors in the FC-PGA370 package only. The
PPGA370 package, while physically installable, will not work in these systems.
2-12 Compaq Deskpro EX Series of Personal Computers
Heat Sink
Retaining Clip
Handle
First Edition – August 2000
Heat Sink
FC-PGA370
Package
PGA370
Socket