Alesis IO/2 Service Manual page 23

UB0MNF - Main PCB Rev F
RevChange Document
Suggested
SCH PCB CAM DATE
by:
x x SOP 3/13/2006
SOP 3/13/2006
SOP 3/13/2006
x JK 3/14/2006
x YH 3/16/2006
x YH 3/16/2006
x YH 3/16/2006
x YH 3/16/2006
x YH 3/16/2006
Last Revised:
3/17/2006
Performed
DATE
by:
JK 3/17/2006 Change all text from Rev E to F
update all Part Types
Review/Integrate all outstanding ECNs
Note: ***A new solderpaste stencil IS NOT required***
JK 3/17/2006 Flood power plane.
The bottom layer pads of C75's negative terminal and
JK 3/16/2006 C76's positive terminal are too close.
The bottom layer pads of C43's negative terminal and
JK 3/16/2006 C44's positive terminal are too close.
The bottom layer pads of C57's negative terminal and
JK 3/16/2006 C68's positive terminal are too close.
The bottom layer pad of C40's negative terminal is too
JK 3/16/2006 close to C41's +3.3V via.
The bottom layer pad of C60's negative terminal is too
JK 3/16/2006 close to one of R68's pads.
Description of change:
TOP LEVEL CHANGES
SCHEMATIC CHANGES
PCB CHANGES
Reason for change:
SOP
SOP
SOP
No SMD components were moved.
The leads of the thru-hole components at these locations, after
being bent during the auto-insertion process (to prevent the
components from falling out), tend to short out against the
neighboring pads during the wave-solder process.