HP G61-306 Maintenance And Service Manual page 84

Removal and replacement procedures
The following illustration shows the replacement thermal material locations for computer models equipped with
graphics subsystems with discrete memory.
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The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system
board components each time the fan/heat sink assembly is removed. Thermal grease is located on the section of
the fan/heat sink assembly 1 that services the processor 2. A thermal pad is located on the section of the
fan/heat sink assembly 3 that services the Northbridge chip 4. Thermal pads are also located on intermediate
sections of the fan/heat sink assembly 5 and 7 that service components 6 and 8 on the system board.
Replacement thermal grease and pads are included with all system board, fan/heat sink assembly, and processor
spare part kits.
Reverse this procedure to install the fan/heat sink assembly.
Maintenance and Service Guide 4–41