Samsung CLX-330x Series Service Manual page 3

2.2.5.3.
2.2.5.4.
2.2.5.5.
2.2.5.6.
2.2.5.7.
2.2.5.8.
2.2.5.9.
2.2.5.10. HVPS board ................................................................................................. 2 − 33
2.2.5.11. Electrical Parts Location ................................................................................. 2 − 34
2.2.6. Engine F/W Control Algorithm ...................................................................................... 2 − 35
2.2.6.1.
2.2.6.2.
2.2.6.3.
2.2.6.4.
2.2.7. Software Descriptions .................................................................................................. 2 − 37
2.2.7.1.
2.2.7.2.
2.2.7.3.
3. Disassembly and Reassembly .............................................................................................................. 3 − 1
3.1. Precautions when replacing parts ................................................................................................ 3 − 1
3.1.1. Precautions when assembling and disassembling ............................................................... 3 − 1
3.1.2. Precautions when handling PBA..................................................................................... 3 − 1
3.1.3. Releasing Plastic Latches .............................................................................................. 3 − 2
3.2. Screws used in the printer.......................................................................................................... 3 − 3
3.3. Replacing the maintenance parts ................................................................................................. 3 − 5
3.3.1. ITB Unit .................................................................................................................... 3 − 5
3.3.2. Fuser Unit .................................................................................................................. 3 − 7
3.3.3. Transfer(T2) roller ....................................................................................................... 3 − 8
3.3.4. Pick up roller .............................................................................................................. 3 − 8
3.4. Replacing the main SVC parts.................................................................................................... 3 − 9
3.4.1. Cover ........................................................................................................................ 3 − 9
3.4.2. ADF Unit................................................................................................................... 3 − 10
3.4.3. OPE Unit ................................................................................................................... 3 − 10
3.4.4. Platen Unit ................................................................................................................. 3 − 11
3.4.5. CIS unit and Scan Drive unit ......................................................................................... 3 − 12
3.4.6. Middle Cover ............................................................................................................. 3 − 13
3.4.7. Fax board................................................................................................................... 3 − 13
3.4.8. HVPS board ............................................................................................................... 3 − 14
3.4.9. LSU.......................................................................................................................... 3 − 14
3.4.10. FRAME BASE-PAPER PATH ....................................................................................... 3 − 15
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Fax board .................................................................................................... 2 − 28
Connection board .......................................................................................... 2 − 28
CTD (Color Tone Density) board ..................................................................... 2 − 29
CRUM Joint board ........................................................................................ 2 − 29
USB Host .................................................................................................... 2 − 30
Wireless LAN board (CLX-330xW_330xFW only) ............................................. 2 − 30
SMPS (Switching Mode Power Supply) Board.................................................... 2 − 31
Feeding ....................................................................................................... 2 − 35
Transfer....................................................................................................... 2 − 35
Fusing......................................................................................................... 2 − 36
LSU............................................................................................................ 2 − 36
Software system overview .............................................................................. 2 − 37
Architecture ................................................................................................. 2 − 37
Data and Control Flow ................................................................................... 2 − 38
Contents
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