2.2.5.4.
2.2.5.5.
2.2.5.6.
2.2.5.7.
2.2.5.8.
2.2.6.
2.2.6.1.
2.2.6.2.
2.2.6.3.
2.2.6.4.
2.2.7.
Software Descriptions .................................................................................................. 2 − 32
2.2.7.1.
2.2.7.2.
2.2.7.3.
3.
Disassembly and Reassembly .............................................................................................................. 3 − 1
3.1.
3.1.1.
3.1.2.
3.1.3.
Releasing Plastic Latches .............................................................................................. 3 − 2
3.2.
Screws used in the printer.......................................................................................................... 3 − 3
3.3.
3.3.1.
Side Cover ................................................................................................................. 3 − 4
3.3.2.
Rear Cover................................................................................................................. 3 − 5
3.3.3.
Front Cover ................................................................................................................ 3 − 6
3.3.4.
Top Cover .................................................................................................................. 3 − 7
3.3.5.
Main Board ................................................................................................................ 3 − 7
3.3.6.
SMPS........................................................................................................................ 3 − 8
3.3.7.
HVPS........................................................................................................................ 3 − 8
3.3.8.
Bin-Full Sensor ........................................................................................................... 3 − 9
3.3.9.
Main Drive unit........................................................................................................... 3 − 9
3.3.12. Retard Roller .............................................................................................................. 3 − 11
3.3.13. Duplex Unit ............................................................................................................... 3 − 12
3.3.14. Transfer Roller............................................................................................................ 3 − 13
3.3.15. LSU.......................................................................................................................... 3 − 13
3.3.16. Fuser Unit .................................................................................................................. 3 − 14
3.3.17. Exit Sensor................................................................................................................. 3 − 14
3.3.19. OPE PBA .................................................................................................................. 3 − 16
Copyright© 1995-2013 SAMSUNG. All rights reserved.
Joint PBA .................................................................................................... 2 − 22
SMPS Board ................................................................................................ 2 − 23
HVPS Board ................................................................................................ 2 − 25
NFC Tag Sticker ........................................................................................... 2 − 26
Feeding ....................................................................................................... 2 − 30
Transfer....................................................................................................... 2 − 30
Fusing......................................................................................................... 2 − 31
LSU............................................................................................................ 2 − 31
Architecture ................................................................................................. 2 − 32
Data and Control Flow ................................................................................... 2 − 33
Contents
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