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IC No.
Pin No.
Pin
name
IC252
40
SO1_1
41
SO1_0
37
SB1_2
38
SB1_1
39
SB1_0
35
SI1_1
36
SI1_0
43
SO2_1
42
SO2_0
46
SB2_2
45
SB2_1
44
SB2_0
48
SI2_1
47
SI2_0
6
SO3_1
7
SO3_0
3
SB3_2
4
SB3_1
5
SB3_0
1
SI3_1
2
SI3_0
9
SO4_1
8
SO4_0
12
SB4_2
11
SB4_1
10
SB4_0
14
SI4_1
13
SI4_0
10. HOW TO REPLACE A FLAT PACKAGE IC
10.1. PREPARATION
- PbF (: Pb free) Solder
- Soldering Iron
Tip Temperature of 700°F ± 20°F (370°C ± 10°C)
Note: We recommend a 30 to 40 Watt soldering iron. An expert
may be able to use a 60 to 80 Watt iron where someone with less
experience could overheat and damage the PCB foil.
- Flux
Recommended Flux: Specific Gravity
Type
RMA (lower residue, non-cleaning type)
Signal
I/O
ACT
name
O
BELL4
O
I
O
O
HOOK4
I
EST4
I
O
BELL5
O
I
O
O
HOOK5
I
EST5
I
O
BELL6
O
I
O
O
HOOK6
I
EST6
I
O
BELL7
O
I
O
O
HOOK7
I
EST7
I
37
Description
-
EXT4
Not used
H
Bell signal issue
H
Not used
H
Not used
H
Not used
L
Off-hook detection
H
DTMF detection
-
EXT5
Not used
H
Bell signal issue
H
Not used
H
Not used
H
Not used
L
Off-hook detection
H
DTMF detection
-
EXT6
Not used
H
Bell signal issue
H
Not used
H
Not used
H
Not used
L
Off-hook detection
H
DTMF detection
-
EXT7
Not used
H
Bell signal issue
H
Not used
H
Not used
H
Not used
L
Off-hook detection
H
DTMF detection
0.82.
Remarks
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