Design Files; Change Log - Texas Instruments CC3200 User Manual

Hardware Description
2.8

Design Files

2.8.1 Hardware
All design files include schematics, layout, Bill of Materials (BOM), Gerber files, and documentation, which
are made available for download from the following URL: http://www.ti.com/tool/cc3200-launchxl-rd.
2.8.2 Revision History
PCB Revision
Rev 3.0B
Rev 3.1
Rev 3.2
Rev 4.1
2.8.3 Software
All design files including firmware patches, software example projects, and documentation are made
available from the
The software development kit (SDK) for the CC3200 LaunchPad kit can be obtained from
http://www.ti.com/tool/cc3200sdk.
18
CC3200 SimpleLink™ Wi-Fi
LaunchPad™ Hardware
Table 10. Change Log
Description
• First baseline revision
The main changes pertain to the bill of materials (BOM) and the layout:
• Replaced the caps C23, C24 with ceramic ones to minimize leakage current
• R62 is made to DNP by default so that the jumper is used to measure the hibernate current
• Miscellaneous silk screen changes to clearly annotate components on the board.
• Layout changes for the DC-DC section to improve the mask margin
• Updated the silk screen to reflect the final markings.
• Added pullup and pulldowns for the serial flash. (Reduces hibernate current to around 17 uA)
• Moved the nRESET pull from VCC_BRD to VBAT_CC (ensures always pulled high).
• Added pullup on UART_TX going to the FTDI to prevent false start bits.
• Added pullup resistor for acccelerometer address to avoid conflict with audio booster pack
• Added 100K pullup on RESET_OUT net for any BP without RESET pulls.
• Changed R61 to 2.7K, R57-> 270 Ω (To solve false entering to bootloader mode)
• Miscellaneous silk changes
SimpleLink Wi-Fi Platform
®
and Internet of Things Solution With MCU
Copyright © 2014–2020, Texas Instruments Incorporated
page.
SWRU372C – June 2014 – Revised March 2020
www.ti.com
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