Bending shield can fence...................5 Replacing shield can fence if damage at repair center ........7 BGA Equipment reflow profiles ..................8 Revision History ......................9 3/00021-2/FEA 209 544/83 A Approved according to 000 21-LXE 107 42/1 Company Internal Sony Ericsson Mobile Communications AB...
Step-by-Step Instructions Replace the component. Use BGA repair equipment. No special treatment due to through pins. • Reassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/83 3/00021-2/FEA 209 544/83 A 2(9) Company Internal Sony Ericsson Mobile Communications AB...
Replace the component. Use BGA repair equipment. After soldering check for solder bridges between solder joints. • Reassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/83 3/00021-2/FEA 209 544/83 A 3(9) Company Internal Sony Ericsson Mobile Communications AB...
Replace the component. Use BGA repair equipment. After soldering check for solder bridges between solder joints. • Reassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/83 3/00021-2/FEA 209 544/83 A 4(9) Company Internal Sony Ericsson Mobile Communications AB...
• Shield fence pliers NTZ 112 537 Equipment • ESD-gloves (cotton gloves) • ESD-wristband Instruction • Disassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/83 3/00021-2/FEA 209 544/83 A 5(9) Company Internal Sony Ericsson Mobile Communications AB...
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Put back a new shield can lid. Press on all sides of the lid until you hear a “click” sound. • Reassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/83 3/00021-2/FEA 209 544/83 A 6(9) Company Internal Sony Ericsson Mobile Communications AB...
Assemble a new shield can fence with BGA repair equipment. • Reassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/83 3/00021-2/FEA 209 544/83 A 7(9) Company Internal Sony Ericsson Mobile Communications AB...
Minimum temperature 215°C Maximum temperature 225°C or 235°C for 10-20 sec Total time Appr. 4-7 min The higher temperature in case the board has extremely high ∆T. 3/00021-2/FEA 209 544/83 A 8(9) Company Internal Sony Ericsson Mobile Communications AB...
Working Instruction, Electrical 3 Revision History Rev. Date Changes / Comments 2004-05-27 Initial release 3/00021-2/FEA 209 544/83 A 9(9) Company Internal Sony Ericsson Mobile Communications AB...