LG -D295 Service Manual page 267

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11. DISASSEMBLE GUIDE
Disassembly Rework Guide
1. Remove the shield can with pin set
* Caution 1 : Lift the 'shield can' for vertical direction.
If not, that is cause of defect.
* Caution 2 : Protect the near ICs with 'bracket' from
HEAT DAMAGE
* Caution 3 : Keep distance 0.6Cm PCB and Heat Gun
nozzle
0.6 Cm
2. Apply additional solder on the soldering spot on PCB
3. Clean the PCB with Neozol.
LGE Internal Use Only
- 267 -
Copyright © 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes

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