LG -D620 Service Manual page 267

Level Location No.
IC,RF
6 U1500
Transceiver,4G
6 U5100 IC,WiFi
6 U4100 IC,PMIC
IC,DC,DC
6 U1201
Converter
Microphone
6 MIC6920
C Condenser
C1134
C5204
Capacitor
6 C5218
Ceramic,Chip
C6700
C6701
C5201
C5215 Capacitor
6
C5223 Ceramic,Chip
C9101
Capacitor
6 C4940
Ceramic,Chip
Capacitor
6 C4144
Ceramic,Chip
C2308
Capacitor
6 C2362
Ceramic,Chip
C7502
Capacitor
6 C4145
Ceramic,Chip
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Description Part Number
EAN62697301
EAN62698901
EAN62739601
EAN62788501
EAB62830801
d
EAE62282201
EAE62286801
EAE62502901
EAE62505701
EAE62506501
EAE62685201
Spec
WTR1625L WTR1625L 2G/3G/4G
GSM/GPRS/EDGE,1X, 1xEV-DO ,WCDMA , TD-
SCDMA , HSPA+/DC-HSPA+ , LTE (FDD) ,TD-LTE,
164pin CSP R/TP 164P QUALCOMM
INCORPORATED.
WCN-3620-0-61WLNSP WiFi(11bgn)+BT4.0+FM
IC for QMC 28nm BB, 3.32*3.55*0.63, 0.4pitch
WLCSP R/TP 61P QUALCOMM
INCORPORATED.
PM8926 2.5 to 4.5V adj 0W CSP R/TP 172P -
QUALCOMM INCORPORATED.
LM3263 2.7V to 5.5V 0.4V to 3.6V 0W MICRO SMD
R/TP 16P MIPI RFFE, 2G/3G/4G, 2.5A Max.(PWM),
2.7 MHz (typ.), 16-bump micro SMD TEXAS
INSTRUMENTS KOREA LTD, HONGKONG
BRANCH.
S08OB383-002 -38DB 150OHM OMNI 1.5 TO 3.6V
3.76 * 2.95 * 1.1T SMD GoerTek Inc. 3 76 * 2 95 * 1 1T SMD G
GRM033R71E102KA01D 0.000000001F 10% 25V
X7R -55TO+125C 0603 R/TP 0.3+/-0.03 MM -
MURATA MANUFACTURING CO.,LTD.
CL03A104KP3NNNC 0.0000001F 10% 10V X5R -
55TO+85C 0603 R/TP 0.3 - SAMSUNG
ELECTRO-MECHANICS CO., LTD.
CL05A106MP5NUNC 10uF 20% 10V X5R -
55TO+85C 1005 R/TP 0.55T max. SAMSUNG
ELECTRO-MECHANICS CO., LTD.
CL10A105KB8NNNC 1uF 10% 50V X5R -
55TO+85C 1608 R/TP 0.9T max. - SAMSUNG
ELECTRO-MECHANICS CO., LTD.
CL05A475MP5NRNC 4.7uF 20% 10V X5R -
55TO+85C 1005 R/TP - - SAMSUNG ELECTRO-
MECHANICS CO., LTD.
C1005X5R1E104K 0.1uF 10% 25V X5R -
55TO+85C 1005 R/TP 0.55T max. TDK KOREA
COOPERATION
- 267 - Copyright © 2014 LG Electronics. Inc. All right reserved.
Remark
T k I
Only for training and service purposes