Table of Contents
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XDR-S40DBP
TABLE OF CONTENTS
1.
2.
2-1. Disassembly Flow ...........................................................
2-2. Cabinet Rear Block .........................................................
2-3. VOL Knob Block ............................................................
2-4. Cabinet Front Assy (CAB1) ............................................
2-5. LCDDAB Board .............................................................
2-6. JACK Board ....................................................................
2-7. MAIN Board Block ........................................................
2-8. MAIN Board ...................................................................
2-9. Module Assy (DAB Module) (DAB1) ............................
3.
............................................................ 10
4.
4-1. Printed Wiring Board - MAIN Board - ........................... 14
4-2. Schematic Diagram - MAIN Board - .............................. 15
4-3. Printed Wiring Board - JACK Board - ............................ 16
4-4. Schematic Diagram - JACK Board - .............................. 17
4-5. Schematic Diagram - LCDDAB Board - ........................ 18
4-6. Printed Wiring Board - LCDDAB Board - ..................... 19
5.
5-1. Overall Section ............................................................... 20
5-2. Rear Cabinet Section ...................................................... 21
5-3. Chassis Section ............................................................... 22
5-4. LCDDAB Board Section ................................................ 23
6.
Accessories are given in the last of the electrical parts list.
2
.............................................
.............................. 24
SERVICING NOTES
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
2
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
3
: LEAD FREE MARK
4
Unleaded solder has the following characteristics.
4
•
Unleaded solder melts at a temperature about 40 °C higher
5
than ordinary solder.
6
Ordinary soldering irons can be used but the iron tip has to be
7
applied to the solder joint for a slightly longer time.
8
Soldering irons using a temperature regulator should be set to
9
about 350 °C.
9
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•
Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
SECTION 1
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