Specifications - ASROCK H510M/ac Manual

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  • ENGLISH, page 1

1.2 Specifications

Platform
CPU
Chipset
Memory
Expansion
Slot
10
• Micro ATX Form Factor
• Solid Capacitor design
th
• Supports 10
Gen Intel® Core
TM
Intel® Core
Processors (LGA1200)
• 5 Power Phase design
• Supports Intel® Turbo Boost Max 3.0 Technology
• Intel® H510
• Dual Channel DDR4 Memory Technology
• 2 x DDR4 DIMM Slots
• Supports DDR4 3200(OC)/2933/2800/2666/2400/2133 non-
ECC, un-buffered memory
th
TM
* 11
Gen Intel® Core
TM
3200(OC); Core
(i3), Pentium® and Celeron® support DDR4 up
to 2666.
th
TM
* 10
Gen Intel® Core
TM
Core
(i5/i3), Pentium® and Celeron® support DDR4 up to 2666.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
• Supports ECC UDIMM memory modules (operate in non-
ECC mode)
• Max. capacity of system memory: 64GB
• Supports Intel® Extreme Memory Profile (XMP) 2.0
th
TM
11
Gen Intel® Core
Processors
• 1 x PCI Express 4.0 x16 Slot*
th
TM
10
Gen Intel® Core
Processors
• 1 x PCI Express 3.0 x16 Slot*
* Supports NVMe SSD as boot disks
• 1 x PCI Express 3.0 x1 Slot
• 1 x M.2 Socket (Key E) with the bundled WiFi-802.11ac
module
TM
Processors and 11
(i9/i7/i5) support DDR4 up to
(i9/i7) support DDR4 up to 2933;
th
Gen

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