Advertisement
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Description #1 ScrewDriver
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Separate Slate side and Dock side
2.
For Slate module :
3.
Dis-fasten Slate moudle Bezel trim screw*2(M2.0*3.5)
4.
Disassemble LCD cover
5.
Pull out battery cable
6.
Dis-fasten screw*40(M2.0*3.5, M2.0*2.5, M2.0*2)
7.
Disassemble Docking FPC
8.
Disassemble Docking cable
9.
Disassemble Battery
10. Pull out Micro SD FFC
11. Disassemble Micro SD/Board
12. Disassemble Audio/Board
13. Disassemble Home Led/Board
14. Disassemble Bezel trim
15. Pull out Fan FPC
16. Disassemble Thermal module
17. Pull out Camera cable
18. Pull out LCD cable
19. Pull out Volume/Board FFC
20. Pull out Power/Board FFC
21. Pull out Antenna cable*2
22. Pull out TS FFC
23. Pull out TS/Board FPC
24. Disassemble TS/Board
25. Disassemble Power/Board
26. Disassemble Volume/Board and Vibrator
27. Disassemble Wlan Card
28. Disassemble SSD card
29. Disassemble Ram module
30. Disassemble Frame
31. Disassemble Main/Board
32. Disassemble Speaker(L&R)
33. Disassemble Antenna module
34. For Dock Module:
35. Pull out Rubber from Base*2
EL-MF877-00
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
0
0
Tool Size (if
applicable)
Page 2
Advertisement
