Connection
5.2 EMC-compliant installation
Diagrams for grounding and high-frequency equipotential bonding measures
The following diagram illustrates all grounding and high-frequency equipotential bonding
measures using the example of a cabinet with a SINAMICS G120.
Grounding measures
①
High-frequency equipotential bonding measures
②
③
④
⑤
Image 5-5
44
Conventional grounding without any special HF properties
Electrically conductive connection to the mounting panel through the largest possible surface
HF equipotential bonding
Connect the shield through a large contact surface and ground
Connect the shield through an electrically conductive heavy-gauge threaded joint (gland) and
ground
Grounding and high-frequency equipotential bonding measures in the drive system and
in the plant
Hardware Installation Manual, 01/2016, A5E36265179B-AA
PM250 Power Module