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Level
Location No.
....4
T0568
....4
T0568
....4
T0568
....4
IC3001_SOC
....4
IC3004_SOC
....4
CN330
....4
CN330
....4
CN330
....4
CN330
....4
L6002
....4
S3001
....4
T0077
....4
IC400
FPGA_
....4
MICOM
.....5
IC4005
....4
C6032
....4
C6088
....4
R6023
....4
SUB05
....4
IC6012
....4
C110
....4
C111
....4
C112
....4
C113
....4
C114
....4
C116
....4
T0568
MAIN_
...3
BN97-02352H
MICOM
....4
IC520
...3
SUB_MICOM
....4
IC520
...3
T0066
...3
T0066
..2
T0159
..2
M0006
Code No.
BEAD-SMD;18ohm,1608,TP,11.8ohm/
3301-001793
BEAD-SMD;18ohm,1608,TP,11.8ohm/
3301-001793
BEAD-SMD;18ohm,1608,TP,11.8ohm/
3301-001793
3704-000001
SOCKET-IC;44P,PLCC,SN,1.27mm
3704-000001
SOCKET-IC;44P,PLCC,SN,1.27mm
3711-005291
3711-005471
3711-005471
3711-005872
COIL-CHOKE(SMD);47uH,47uH,20%,12*12*8
BN27-00002A
SENSOR SW-TILT;SPSF100100,DC5V,1mA,-10
BN32-00005A
BN41-00788A
PCB MAIN;LED20BS,FR-4,6L,1.0,1.6T,240*18
IC-FPGA;EP2C50,BGA,484P,17x17mm,3.3V,3
1301-001800
ASSY MICOM-AMZ,W/W;LS20EDB*,W/
BN97-01255A
IC-PROM;EPCS16,16MBIT,16MBIT,SOP,16P,
1101-001070
2402-001216
C-AL,SMD;470uF,20%,16V,WT,TP,10.3x10.3x1
2402-001216
C-AL,SMD;470uF,20%,16V,WT,TP,10.3x10.3x1
2007-000987
R-CHIP;5.6ohm,5%,1/10W,TP,1608
0202-001477
IC-VOLTAGE COMP.;393,SOP,8P,150MIL,DU
1202-000104
2203-000888
C-CER,CHIP;4.7nF,10%,50V,X7R,TP,1608
2203-000888
C-CER,CHIP;4.7nF,10%,50V,X7R,TP,1608
2203-000888
C-CER,CHIP;4.7nF,10%,50V,X7R,TP,1608
2203-000888
C-CER,CHIP;4.7nF,10%,50V,X7R,TP,1608
2203-000888
C-CER,CHIP;4.7nF,10%,50V,X7R,TP,1608
2203-000888
C-CER,CHIP;4.7nF,10%,50V,X7R,TP,1608
BEAD-SMD;60ohm,3225,TP,43ohm/
3301-001082
ASSY MICOM-AMZ,LASIC(FRANCE);LS20EDE
IC-MICROCONTROLLER;WT61P6,PLCC,44P,1
0903-001400
ASSY MICOM-AMZ,LASIC(FRANCE),S;LS20ED
BN97-02352J
IC-MICROCONTROLLER;WT61P6,PLCC,44P,1
0903-001400
BP62-00017A
HEAT SINK-ES;SP-50L2HX,A6063S,T2.0,26.2,
BP62-00017A
HEAT SINK-ES;SP-50L2HX,A6063S,T2.0,26.2,
ASSY PCB P-SMPS;EDISON20,Monitor,-
BN96-04034A
BN96-04179A
ASSY SHIELD P-COVER;EDISON 20,SECC,T0.8
Description & Specification
37.6MHz,2
37.6MHz,2
37.6MHz,2
HEADER-BOARD TO
CABLE;BOX,2P,1R,2MM,SMD-
HEADER-BOARD TO
CABLE;BOX,12P,1R,1.25mm,
HEADER-BOARD TO
CABLE;BOX,12P,1R,1.25mm,
HEADER-BOARD TO
CABLE;BOX,5P,1R,2MM,SMD-
mm,
~
0%
W(FPGA)
10.
SOLDER-CREAM;LST309-
M,D20~45um,96.5Sn/3A
AL,
40MHz,83ohm
EB/L
6.58
EEB
6.58
,AC100
5. Exploded View & Part List
Q'ty
SA/SNA Remark
1
S.A
1
S.A
1
S.A
1
S.A
1
S.A
1
S.N.A
1
S.N.A
1
S.N.A
1
S.N.A
1
S.A
1
S.A
1
S.N.A
1
S.A
1
S.N.A
1
S.A
1
S.A
1
S.A
1
S.A
0.223
S.N.A
1
S.A
1
S.A
1
S.A
1
S.A
1
S.A
1
S.A
1
S.A
1
S.N.A
1
S.N.A
1
S.N.A
1
S.N.A
1
S.N.A
1
S.N.A
1
S.N.A
1
S.A
1
S.N.A
5-17
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