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HP Pro 3080 Disassembly Instructions Manual
HP Pro 3080 Disassembly Instructions Manual

HP Pro 3080 Disassembly Instructions Manual

Microtower business pc
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Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP Pro 3080 Microtower Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
EL-MF877-00
Template Revision B
Notes
With a surface greater than 10 sq cm
All types including standard alkaline and lithium coin
or button style batteries
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps
Fans
PSG instructions for this template are available at
EL-MF877-01
Quantity of
items
included in
product
2(1 sys
board,
1 P/S
board)
1
0
0
0
0
6( P/S board
Capacitors,)
0
0
3
Page 1

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Summary of Contents for HP Pro 3080

  • Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
  • Page 2: System Board

    Components and parts containing toner and ink, Include the cartridges, print heads, tubes, vent including liquids, semi-liquids (gel/paste) and toner chambers, and service stations. Components and waste containing asbestos Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances 1.3 Markings for plastic parts greater than 25 grams Plastic Part...
  • Page 3 ( 6). Remove the system board: (see Figure 5 below) (a)Remove the 8 screws that secure the system board to the chassis. (b) Lift the system board and depart form stand-off. (c) Slide the system board towards the front of the chassis then remove it.
  • Page 4 Figure 1: Remove the two screws Figure 2: Remove the access panel Figure 3: Remove the front bezel Figure 4: Remove 4 screws then take heat sink Figure 5: Remove the system board Figure 6: Power supply screw locations on the chassis EL-MF877-00 Page 4 Template Revision B...
  • Page 5 Figure 8: Power supply cover screw locations on the right side Figure 7: Power supply cover screw locations on the left side Figure 9: Cut the plastic cable clamp Figure 10: Remove the fan and AC Inlet screws Figure 11: Power supply PCA and AC Inlet screw location Figure 12: Cut all cables connected to the board EL-MF877-00 Page 5...
  • Page 6 Figure 13 : Electrolytic Capacitors location Figure 14 : Heat the solder of Electrolytic Capacitors Figure 15 : Remove the Electrolytic Capacitors Figure 16 : Type 1 battery holder Figure 17 : Type 2 battery holder Figure 18 : Type 3 battery holder EL-MF877-00 Page 6 Template Revision B...
  • Page 7 EL-MF877-00 Page 7 Template Revision B PSG instructions for this template are available at EL-MF877-01...