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Related Manuals for Sierra Wireless AirPrime BX3100
Summary of Contents for Sierra Wireless AirPrime BX3100
- Page 1 AirPrime BX3100/BX3105 Wi-Fi/BT Module Hardware Integration Guide 41112607 Rev 3...
- Page 2 MODE OR POWERED OFF. The Sierra Wireless modem can transmit signals that could interfere with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE IN AIRPLANE MODE OR POWERED OFF.
- Page 3 Preface Patents This product may contain technology developed by or for Sierra Wireless Inc. This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents licensed from MMP Portfolio Licensing. Copyright ©2018 Sierra Wireless. All rights reserved.
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Page 4: Table Of Contents
Contents 1: Introduction ............6 1.1 Module Variants . - Page 5 Contents 4.7 Bootstrap Pins ........... . . 19 4.8 SPI Bus .
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Page 6: 1: Introduction
BT Host-less module’s high-level product features, interfaces, and hardware features (including electrical and mechanical performance criteria). 1.1 Module Variants AirPrime BX310x module variants include: • AirPrime BX3100—External antenna connection • AirPrime BX3105—Embedded antenna 1.2 General RF/Software Features The AirPrime BX310x is a low-power, small form-factor self-contained Wi-Fi/ ®... -
Page 7: Interfaces
Introduction 1.2.3 Interfaces The AirPrime BX310x provides the following interfaces and peripheral connectivity: • Power supply—See Power Supply Ratings on page 11. • RF—See RF on page 12. • UART serial link—See UART on page • ADC/Voltage measurement—See ADC/Voltage Measurement on page 16. •... - Page 8 Hardware Integration Guide The LGA pads have the following distribution: Table 1-3: LGA Pad Types Pad Type / Quantity Dimensions Pitch Signal Pads 54 outer pads 0.75x0.35 mm 0.65 mm Ground Pads 16 inner pads 1.0x1.0 mm 1.83 mm/1.48 mm Rev 3 Sep.18 41112607...
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Page 9: 2: Functional Specifications
Description Secure boot • Secure update • Module FOTA (Firmware update Over The Air) • Sierra Wireless AirVantage support • CF3-compliant footprint (BX3100) • Protocols: • 802.11 b/g/n/e/i · 802.11 n (2.4 GHz), up to 150 Mbps; MCS0-7 in 20/40 MHz bandwidths ·... - Page 10 Hardware Integration Guide Table 2-1: AirPrime BX310x Capabilities (Continued) Feature Description Bluetooth v4.2 BR/EDR and BLE compliant • Supported channels: BT Classic —0–78; BLE—0–39 • Supported v4.2 modes: BR (Basic Rate); EDR (Enhanced Data Rate); LE • (Low Energy) classic mandatory features •...
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Page 11: 3: Technical Specifications
3: Technical Specifications 3.1 Environmental The environmental specifications for operation and storage of the AirPrime BX310x are defined in Table 3-1. Table 3-1: Environmental Specifications Parameter Range Ambient Operating Temperature -40°C to +85°C -40°C to +105°C Ambient Storage Temperature (Recommended) 3.2 Power Supply Ratings DC power is supplied via the pins described in Table 3-2 on page... -
Page 12: Generic Radio
Hardware Integration Guide Table 3-3 describes the AirPrime BX310x’s supported power modes. Table 3-3: Power Modes — Descriptions Wi-Fi / BT radio / ULP co- Power Mode baseband processor Notes Active Fully functional Radio off Light sleep Pause Wake up events will wake the module. Deep sleep On/Off Connection data stored in RTC memory... -
Page 13: Bluetooth Radio
Technical Specifications Table 3-5: Generic Radio Characteristics (Continued) Description Unit Conducted Receiver Sensitivity 11g OFDM, 54 Mbps -71.5 Conducted Receiver Sensitivity 11n HT20 OFDM, 72.2 Mbps Conducted Receiver Sensitivity 11n HT40 OFDM, 135 Mbps Conducted Harmonics 2F0 Conducted Harmonics 3F0 a. -
Page 14: Electrical Specifications
Hardware Integration Guide 3.5 Electrical Specifications 3.5.1 Absolute Maximum Ratings Table 3-7: Absolute Maximum Ratings Parameter Units Input low voltage -0.3 0.25V Input high voltage 0.75V Input leakage current Output low voltage 0.1V Output high voltage 0.8V Input pin capacitance VDD_PADS_BB GPIO maximum drive capability C... -
Page 15: 4: Interfaces Specification
4: Interfaces Specification 4.1 Overview This section describes the interfaces supported by the AirPrime BX310x embedded module and provides specific voltage, timing, and circuit recommendations for each interface. 4.2 UART The AirPrime BX310x provides one UART interface for asynchronous communication between the AirPrime BX310x module and a host device (e.g. -
Page 16: Adc/Voltage Measurement
Hardware Integration Guide · Common baud rates are supported—any baud rate in the supported range can be selected via AT+IPR=<uart_baud_rate> command. The device automatically configures the clock dividers appropriately for the chosen baud rate. · Baud rates are persistent post-reset. ·... -
Page 17: I2C Interface
Interfaces Specification 4.4 I C Interface The AirPrime BX310x module provides two I C (Inter-Integrated Circuit) dedicated serial ports (bus interface) based on [2] The I2C Bus Specification, Version 2.1, January 2000 (Phillips Semiconductor document number 9398 393 40011). The interfaces use the pins indicated in Table 4-4. -
Page 18: I2S Interface (Digital Audio)
Hardware Integration Guide 4.5 I2S Interface (Digital Audio) Note: Interface support is forthcoming. The AirPrime BX310x provides a 4-wire I S (digital audio) interface that can be used to transfer serial digital audio to or from an external stereo DAC/ADC, and supports the following features: •... -
Page 19: Bootstrap Pins
Interfaces Specification Table 4-7: GPIO Pins (Alternate function) Signal Name Direction Default State Function Voltage Level GPIO(23) No pull GPIO(0) Pull high GPIO(25) No pull GPIO(34) No pull GPIO(35) No pull GPIO(32) No pull GPIO(33) No pull GPIO(18) No pull GPIO(26) No pull GPIO(36) -
Page 20: Spi Bus
Hardware Integration Guide Table 4-8: GPIO Bootstrap Functions GPIO Function Default State Default Function Alternative Boot Source High, Internal pull 45 k Boot from Internal Flash Download to Flash (Disabled) Boot Source High, Internal pull 45 k High, Internal pull 45 k SDIO Slave Timing Rising Edge Input &... -
Page 21: Secure Digital Io (Sdio) Interface
Interfaces Specification Table 4-10: SPI Pin Descriptions (Continued) Direction SPI Master SPI Slave 6-Wire Signal Name 5-Wire Signal Name Master Slave Function HSPID MOSI MOSI HSPIWP Write Protect (M) HSPIHD SRDY Hold a. Leave open any pins that are not used. b. -
Page 22: Module Enable
Hardware Integration Guide SDIO is particularly susceptible to tracking impedance and length variations between the SDIO tracks. Ensure that controlled impedance tracking is used, and minimize tracking length between the module and SD slave device. Add series resistor footprints at the host end to decrease the drive current and reduce potential interference, and match the length of all the SD tracks to within 1 mm. -
Page 23: 5: General Layout Recommendations
5: General Layout Recommendations In addition to specific requirements for the antenna implementation and clearance of the BX3105 detailed in this document, good mixed-signal layout practices should be followed: • Avoid tracking of high frequency signals near the RF sections of the module. •... -
Page 24: 6: Regulatory Compliance
• Bluetooth SIG Additional certifications and details on specific country approvals may be obtained upon customer request — contact your Sierra Wireless account representative for details. Additional testing and certification may be required for the end product with an embedded BX3100/BX3105 module and are the responsibility of the OEM. Sierra Wireless offers professional services-based assistance to OEMs with the testing and certification process, if required. -
Page 25: Canada
2. The end product integrating the BX3100 module must use the RF trace design approved with the BX3100 module. Details of the trace design can be obtained from Sierra Wireless upon request. 3. At least 4.5 cm separation distance between the antenna and the user’s body, or 3 cm separation distance when the end product is designed or intended for use on extremities, or mainly operated in extremity-only exposure conditions, i.e.,... - Page 26 Hardware Integration Guide 4. The regulatory label on the end product must include the text “Contains IC: 2417C-BX31A” and the following compliance statement: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) This device may not cause interference, and (2) this device must accept any interference, including interfer- ence that may cause undesired operation of the device.
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Page 27: 7: Pinout
7: Pinout The system interface of the AirPrime BX310x is through the LGA pattern on the bottom of the PCB. AirPrime BX310x pins are divided into three functional categories: • Core functions and associated pins—Cover all the mandatory features for M2M connectivity and will be available by default across all CF3 family of modules. -
Page 28: Pin Configuration
Hardware Integration Guide 7.1 Pin Configuration Figure 7-1 illustrates the pin configuration of the AirPrime BX310x module. Figure 7-1: Pin Configuration (Bottom View) 7.2 Pin Description Table 7-1 on page 28 lists detailed information for the LGA pins. Important: Leave open all pins that are not used. Table 7-1: Pin Definitions Signal name Group... - Page 29 Pinout Table 7-1: Pin Definitions (Continued) Signal name Group Voltage Active Function Type Reserved NoConnect Reserved NoConnect GPIO(23) GPIO General Purpose I/O VDD_PADS_BB I2C1_SCL I2C1 Primary I2C interface—Clock Reserved NoConnect Reserved NoConnect Reserved NoConnect Reserved NoConnect GPIO(5) GPIO VDD_PADS_BB General Purpose I/O Reserved NoConnect I2S_MCLK...
- Page 30 Hardware Integration Guide Table 7-1: Pin Definitions (Continued) Signal name Group Voltage Active Function Type Ground Ground GPIO(36) GPIO General Purpose I/O VDD_PADS_BB SENSOR_VP VoltMeasure ADC input for voltage measurement GPIO(37) GPIO General Purpose I/O VDD_PADS_BB SENSOR_CAPP VoldMeasure ADC input for voltage measurement VGPIO Power 3.3V...
- Page 31 Pinout Table 7-1: Pin Definitions (Continued) Signal name Group Voltage Active Function Type SD_DATA1 SDIO SDIO Data bit 1 HSPIHD VDD_PADS_BB SPI Hold GPIO(4) GPIO General Purpose I/O Reserved NoConnect Reserved NoConnect 2.8 (Min) VDD_3V3_RF Power 3.3V (Typ) 3.3v nominal supply for Analog/RF 3.6 (Max) 2.8 (Min) 3.3v nominal supply for Internal...
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Page 32: 8: References
8: References 8.1 Web Site Support Check http://source.sierrawireless.com for the latest documentation available for the AirPrime BX310x. 8.2 Reference Documents [1] AirPrime BX310x AT Command Reference Reference number: 41111445 [2] The I C Bus Specification, Version 2.1, January 2000 (Phillips Semiconductor document number 9398 393 40011) Rev 3 Sep.18 41112607... -
Page 33: 9: Abbreviations
9: Abbreviations Table 9-1: Acronyms and Definitions Acronym or term Definition Adaptive Frequency Rate Hopping Access Point Bluetooth Low Energy Basic Rate Basic Service Set Bluetooth (Classic) Enhanced Data Rate Enhanced Data Rate Generic Access Profile General Access Profile GATT General Attribute Profile HTTP Hypertext Transfer Protocol...