3.
Remove the fan/heat sink assembly (3).
4.
Thoroughly clean the thermal material from the surfaces of the fan/heat sink assembly and the system
board components each time the fan/heat sink assembly is removed. Replacement thermal material is
included with the fan/heat sink assembly and system board spare part kits.
Thermal paste is used on the processor (1) and the heat sink section (2) that services it. Thermal paste
is also used on the VGA component (3) and the heat sink section (4) that services it.
Component replacement procedures
59