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KX-F910BX
HOW TO REPLACE FLAT PACKAGE IC
PREPARATION
PROCEDURE
1. Temporarily fix FLAT PACKAGE IC by soldering on two marked pins.
*Check accurate setting of IC to the corresponding soldering foil.
2. Apply flux for all pins of FLAT PACKAGE IC.
3. Solder using specified solder, in direction of arrow, by sliding the soldering iron.
MODIFICATION PROCEDURE OF BRIDGE
1. Re-solder slightly on bridged portion.
2. Remove remaining solder along pins using soldering iron as shown in below figure.
ESOLDER
E Soldering iron
E Flux
Sparkle Solder 115A-1, 115B-1
OR
Almit Solder KR-19, KR-19RMA
Recommended power consumption will be between 30 W to 40 W.
Temperature of Copper Rod 662 } 50 F (350 }10
(An expert may handle 60~80 W iron, but beginner might
damage foil by overheating.)
HI115
Specific gravity 0.863
(Original flux will be replaced daily.)
Soldering iron
Specified solder
bridge
|126 |
°
)
Temporary soldering point.
Flux
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