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Multi-Tech uses and recommends that others use anti-static boxes that create a faraday cage (packaging designed
to exclude electromagnetic fields). Multi-Tech recommends that you use our packaging when returning a product
and when you ship your products to your customers.
USB Design Considerations
Multi-Tech recommends consulting Intel's High Speed USB Platform Design Guidelines, Rev. 1.0 for information
about USB signal routing, impedance, and layer stacking. Also:
Shield USB cables with twisted pairs (especially those containing D+/D-).
Use a single 5V power supply for USB devices. Consult your model's Device Guide for Power Draw section for
current (ampere) requirements.
Route D+/D- together in parallel with the trace spacing needed to achieve 90 ohms differential impedance
for the USB pair and to maintain a 20 mil space from the USB pair and all other signals.
If power is provided externally, use a common ground between the carrier board and SocketModem.
Phone Line Warning Statement for the Developer Board
(Analog only) Use extreme caution when the phone line is installed due to live energized components. Do not
touch any components on the board while the phone line is installed.
Detach the phone line when making modifications to or servicing the developer board.
For other telephone warnings, refer to the Telecom Warnings
Mounting Hardware and Tooling Holes
Refer to individual Device Guide for specific hardware requirements.
Soldering
Multi-Tech uses a wave soldering process:
Solder pot temperature:
Preheat zone 1:
Preheat zone 2:
Preheat zone 3:
Belt speed:
Preheat zones have top and bottom heaters.
WARNING:
Do not wash. Washing may damage the device.
NOTE: Conditions of Acceptability for UL are available upon request at
Universal Socket Developer Guide
275C
135C
160C
175C
35.4 inches per minute
CHAPTER 3 – UNIVERSAL DESIGN CONSIDERATIONS
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