Table Of Contents - Sony NW-E50 Service Manual

NW-E50/E70

TABLE OF CONTENTS

1. GENERAL
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2. TEST MODE
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3. DISASSEMBLY
3-1. Case, Chassis (Front) Assy ··········································· 6
3-2. DISPLAY Board Assy ·················································· 7
3-3. MAIN Board Assy ························································ 7
4. DIAGRAMS
4-1. Block Diagram ······························································ 9
4-2. Printed Wiring Board
- DISPLAY Board (Side A) - ····································· 10
4-3. Printed Wiring Board
- DISPLAY Board (Side B) - ····································· 11
4-4. Schematic Diagram - DISPLAY Board - ·················· 12
4-5. Printed Wiring Board - MAIN Board (Side A) - ······· 13
4-6. Printed Wiring Board - MAIN Board (Side B) - ······· 14
4-7. Schematic Diagram - MAIN Board (1/2) - ··············· 15
4-8. Schematic Diagram - MAIN Board (2/2) - ··············· 16
5. EXPLODED VIEWS
5-1. Overall Assy Section ··················································· 18
5-2. MAIN Board Section ·················································· 19
6. ELECTRICAL PARTS LIST
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270°C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
2
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registered trademarks of Microsoft Corporation in the United States
and/or other countries.
US and foreign patents licensed from Dolby Laboratories.
All other trademarks and registered trademarks are trademarks or
registered trademarks of their respective holders.
UNLEADED SOLDER
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Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
• IC400 (microcomputer) and IC450 (nor flash sram) on MAIN
board cannot be replaced individually.
Replace it with MAIN board assembly for service.