SUB UNIT (KD-R54x series) GEA10354-03A (GEB10354-001A)
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
F1A
GEA10354A
S1A
1
IC80
X89-3130-10
No.MA538
created date:2013-02-18
(No.MA538<Rev.003>)12/19