Replaceable Components - Sony Ericsson C510 Replacement Manual

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Replaceable Components

EXPLANATION OF ABBREVIATIONS USED IN THE COLUMN 'COMMENTS' BELOW

COMPONENT LOCATION

P = Primary Side

S = Secondary Side

MOISTURE SENSITIVITY LEVEL

MSLX (X = 1, 2, 2A, 3, 4, 5, 5A or 6)

For more information on moisture sensitivity levels:

Refer to 1220-1336: Generic Repair Manual – electrical, section 'Moisture & Baking'!

REPAIR METHOD

HA = Hot Air (removal & mounting)

ST = Soldering Tool (removal & mounting)

HA/ST = Hot Air for removal - Soldering Tool for mounting

BGA = BGA Station

BH = Bottom Heater

ADDITIONAL INFORMATION

1 (2,3,4, etc.) = Proceed to 'Additional Repair Info' for further instructions in the indicated section(s).

CALIBRATION

C = Calibration of the phone is required after replacing the component

Calibration to be done by authorized centers only!

1223-6749 Rev 7

Sony Ericsson Mobile Communications AB – Company Internal

Component Replacement Repair Drawing Additional Soldering Process/

3(3)

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