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Both PA blocks share common power supply pads to distribute current. The output of each PA
Both PA blocks share common power supply pads to distribute current. The output of each PA block and
block and the outputs to the four receive pads are connected to the antenna pad through a
the outputs to the four receive pads are connected to the antenna pad through a PHEMT RF switch. The
PHEMT RF switch. The GaAs die, PHEMT die, Silicon (Si) die and passive components are mounted
GaAs die, PHEMT die, Silicon (Si) die and passive components are mounted on a multi-layer laminate
on a multi-layer laminate substrate. The assembly is encapsulated with plastic overmold.
substrate. The assembly is encapsulated with plastic overmold.
1.
= DON'T CARE
R319
10K
APC
R302
1K
PA_EN
BAND_SW1
BAND_SW2
C327
6p
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Table 3.3.1 Band SW Logic Table
R301
C334
C333
C336
18K
6p
22p
220p
33
PGND3
32
PGND2
31
PGND1
10
GND5
11
PCS
RX1
DCS
12
RX2
U303
EGSM
13
RX3
SKY77547
GSM850
14
RX4
15
GND6
16
GND7
36
PGND6
35
PGND5
34
PGND4
Figure 3.3.2 TX-module CIRCUIT DIAGRAM
VRF
VBAT
C332
22p
1
GND1
30
VBATT
29
DCS_PCS_IN
28
GND17
27
GSM_IN
26
GND16
25
C316
GND15
DNI
- 27 -
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
C324
C326
C329
33p
DNI
10u
C345
33p
DCS_PCS_OUT
C346
33p
GSM_OUT
C325
DNI
LGE Internal Use Only
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