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3. TECHNICAL BRIEF
3.1.6 Connectivity
• 3 sets of UART with hardware flow control and speed up to 921600 bps
• IrDA modulator/demodulator with hardware framer supports SIR mode of operation
• HS/FS/LS USB 2.0 Device controller
• Multi Media Card/Secure Digital Memory Card/Memory Stick/Memory Stick Prto/SDIO host controller
• Supports SDIO interface for SDIO peripherals as well as WIFI connectivity
• DAI/PCM and !2S interface for Audio application
3.1.7 Low Power Schemes
• Power Down Mode for analog and digital circuits
• Processor Sleep Mode
• Pause Mode of 32KHs clocking at Standby State
• 3-channel Auxiliary 10-bit A/D Converter for application usage other than battery monitoring
3.1.8 Power and Supply Management
• 2.8V to 4.7V Input Range
• Charger Input up to 8V
• 11 sets of LDO Optimized Specific GSM Sub-systems
• One LDO for RF transceiver
• High Operation Efficiency and Low Stand-by Current
• Dual SIM Card Interface
• One boost regulator and Four Open-Drain Output Current Regulators to Supply/Control the LED
• LDO type Vibrator
• One NMOS switch to control R(GB) LED
• Thermal Overload Protection
• Under Voltage Lock-out Protection
• Over Voltage Protection
3.1.9 Integrated RF Receiver
• Direct conversion architecture
• Quad band differential input LNAs
• Quadrature RF mixers
• Fully integrated channel filter with f3dB=150kHs
• 95dB gain with 60dB gain control range
• No IIP2 calibration
LGE Internal Use Only
3. TECHNICAL BRIEF
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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
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