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LG B2100 Service Manual

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Service Manual
B2100
P/N : MMBD0047901
Date: April, 2005 / Issue 1.0

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Summary of Contents for LG B2100

  • Page 1 Service Manual B2100 P/N : MMBD0047901 Date: April, 2005 / Issue 1.0...

  • Page 2: Table Of Contents

    1. INTRODUCTION Table Of Contents 1. INTRODUCTION........ 6 4.2 Tx Trouble ..........56 4.3 Power On Trouble......... 64 1.1 Purpose ..........6 4.4 Charging Trouble ........ 66 1.2 Regulatory Information ......6 4.5 Vibrator Trouble ........68 1.3 Abbreviations ..........8 4.6 LCD Trouble ........
  • Page 3 1. INTRODUCTION Table Of Contents 7.5 RF Circuit ..........106 11.7 Setting ..........121 7.6 CAMERA ..........107 11.8 How to do calibration .......121 8. PCB LAYOUT ......108 12. EXPLODED VIEW & REPLACEMENT PART LIST ..123 12.1 Exploded View ........123 9.

  • Page 4: Introduction

    1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.
  • Page 5 1. INTRODUCTION E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F.

  • Page 6: Abbreviations

    1. INTRODUCTION 1.3 Abbreviations For the purposes of this manual, following abbreviations apply: Automatic Power Control Baseband Bit Error Ratio CC-CV Constant Current - Constant Voltage Digital to Analog Converter Digital Communication System dB relative to 1 milli watt Digital Signal Processing EEPROM Electrical Erasable Programmable Read-Only Memory Electrostatic Discharge...
  • Page 7 1. INTRODUCTION Time Division Duplex TDMA Time Division Multiple Access UART Universal Asynchronous Receiver/Transmitter Voltage Controlled Oscillator VCTCXO Voltage Control Temperature Compensated Crystal Oscillator Wireless Application Protocol Service Manual /...

  • Page 8: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 H/W Features Item Feature Comment Li-ion, 780mAh Standard Battery Battery Size : 104.5 (W) 44(H) 15.8(T) [mm] Battery Weight : 20kg Under the minimum current consumption Stand by Current environmenth (such as paging period 9), the level of standby current is below 4mA.

  • Page 9: Technical Specification

    2. PERFORMANCE 2.2 Technical Specification Item Description Specification EGSM TX: 890 + (n-1024) 0.2 MHz RX: 935 + (n-1024) 0.2 MHz (n=975~1024) Frequency Band TX: 1710 + (n-512) 0.2 MHz RX: 1805 + (n-512) 0.2 MHz (n=512~885) TX: 1810 + (n-512) 0.2 MHz RX: 1905 + (n-512) 0.2 MHz (n=512~885) Phase Error RMS <...
  • Page 10 2. PERFORMANCE Item Description Specification GSM, EGSM Offset from Carrier (kHz). Max. dBc +0.5 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 Output RF Spectrum 6,000 (due to modulation) GSM, EGSM Offset from Carrier (kHz). Max. dBc +0.5 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000...
  • Page 11 2. PERFORMANCE Item Description Specification DCS,PCS Offset from Carrier (kHz). Max. dBc 1,200 1,800 Spurious Emissions Conduction, Emission Status GSM, EGSM BER (Class II) < 2.439% @-102 dBm Bit Error Ratio DCS, PCS BER (Class II) < 2.439% @-100 dBm RX Level Report Accuracy Conduction, Emission Status 8 3 dB Frequency (Hz)
  • Page 12 2. PERFORMANCE Item Description Specification STMR 13 5 dB Stability Margin > 6 dB dB to ARL (dB) Level Ratio (dB) 17.5 22.5 30.7 33.3 Distortion 33.7 31.7 25.5 3,400 4,000 Side Tone Distortion Three stage distortion < 10% System frequency 2.5 ppm (13 MHz) tolerance 32.768KHz tolerance...
  • Page 13 2. PERFORMANCE Item Description Specification Battery Bar Number Voltage Battery Indicator 3.76 ~ 3.89 V 3.90 V ~ 3.59 0.03V (Call) Low Voltage Warning 3.50 0.03V (Standby) Forced shut down 3.35 0.03V Voltage 1 Li-ion Battery Standard Voltage = 3.7 V Battery Type Battery full charge voltage = 4.2 V Capacity: 780mAh...

  • Page 14: Technical Brief

    3. TECHNICAL BRIEF 3. TECHNICAL BRIEF 3.1 Transceiver (SI4205-BM, U500) The RF parts consist of a transmitter part, a receiver part, a frequency synthesizer part, a voltage supply part, The Aero I transceiver is the integrated RF front end for multi-band GSM/GPRS digital cellular and a VCTCXO part.
  • Page 15 3. TECHNICAL BRIEF (1) Receiver Part The Aero I transceiver uses a low-IF receiver architecture which allows for the on chip integration of the channel selection filters, eliminating the external RF image reject filters and the IF SAW filter required in conventional super-heterodyne architectures.
  • Page 16 3. TECHNICAL BRIEF Figure. 3-2 SI4205 RECEIVER PARTIAGRAM B. Intermediate frequency (IF) and Demodulation A quadrature image-reject mixer downconverts the RF signal to a 100KHz intermediate frequency (IF) with the RFLO from the frequency synthesizer. The RFLO frequency is between 1737.8 to 1989.9 MHz, and is internally divided by 2 for GSM 850 and E-GSM 900 modes.
  • Page 17 3. TECHNICAL BRIEF (2) Transmitter Part The transmit (Tx) section consists of an I/Q baseband upconverter, and offset phase-locked loop (OPLL) and two output buffers that can drive external power amplifiers (PA), one for the GSM 850 (824-849 MHz) and E-GSM 900 (880-915 MHz) bands and one for the DCS 1800 (1710-1785 MHz) and PCS 1900 (1850-1910MHz) bands.
  • Page 18 3. TECHNICAL BRIEF B. OPLL The OPLL consists of a feedback mixer, a phase detector, a loop filter, and a fully integrated TXVCO. The TXVCO is centered between the DCS 1800 and PCS 1900 bands, and its output is divided by 2 for the GSM 850 and E-GSM 900 bands.
  • Page 19 3. TECHNICAL BRIEF (3) Frequency Synthesizer Figure. 3-4 SI4205 FREQUENCY SYNTHESIZER PART The Aero I transceiver integrates two complete PLLs including VCOs, varactors, resonators, loop filters, reference and VCO dividers, and phase detectors. The RF PLL uses two multiplexed VCOs. The RF1 VCO is used for receive mode, and the RF2 VCO is used for transmit mode.

  • Page 20: Power Amplifier Module

    3. TECHNICAL BRIEF 3.2 Power Amplifier Module (RF3166, U501) The RF3166 is a high-power, high-efficiency power amplifier module with integrated power control that provides over 50dB of control range. The device is a self-contained 6mmx6mm module with 50 input and output terminals.

  • Page 21: 13 Mhz Clock

    3. TECHNICAL BRIEF 3.3 13 MHz Clock (VCTCXO, X500) The 13 MHz clock(X500) consists of a TCXO(Temperature Compensated Crystal Oscillator) which oscillates at a frequency of 13 MHz. It is used within the Si4205, analog base band chipset (U101, AD6537BABC), digital base band chipset (U100, AD6527B).
  • Page 22 3. TECHNICAL BRIEF Figure 3-7 RF LDO CIRCUIT DIAGRAM / Service Manual...

  • Page 23: Digital Main Processor

    3. TECHNICAL BRIEF 3.5 Digital Main Processor (AD6527B, U100) Figure 3-8. SYSTEM INTERCONECTION OF AD6527B EXTERNAL INTERFACE Service Manual /...
  • Page 24 3. TECHNICAL BRIEF AD6527 is an ADI designed processor. • AD6527 consists of • 1. Control Processor Subsystem 32-bit ARM7TDMI Control Processor • 58.5 MHz operation at 1.7V • On-board 16KB instruction/Data Cache • 1 Mbits of on-chip System SRAM •...
  • Page 25 3. TECHNICAL BRIEF 3.5.1 Interconnection with external devices A. RTC block interface Countered by external X-TAL The X-TAL oscillates 32.768KHz B. LCD module interface The LCD module is controlled by CAMERA IC, CL761S If CL761S is in the state of by-pass mode, the LCD control signals from AD6527 are by-passed through CL761S.
  • Page 26 3. TECHNICAL BRIEF The backlight of LCD module is controlled by DBB via TPS60230RGTR , U400. The control signals related to Backlight LED are given bellow. Signals Description LCD-BL-EN LCD Backlight IC En / Disable (GPO-23) LCD-DIM-CTL Control LCD backlight level in 16 steps (GPIO-5) LCD-LED-CTR Voltage source for LCD Backlight LED...
  • Page 27 3. TECHNICAL BRIEF D. SIM interface The AD6527 provides SIM Interface Module. The AD6527 checks status periodically during established call mode whether SIM card is inserted or not, but it doesn't check during deep Sleep mode. In order to communicate with SIM card, 3 signals SIM-DATA, SIM-CLK, SIM-RST(GPIO-23) are required. The descriptions about the signals are given by bellow Table 3-6 in detail.
  • Page 28 3. TECHNICAL BRIEF 3.5.2 AD6527B Architecture Figure 3-10. AD6527 Architecture The internal architecture of AD6527 is shown above Figure 3-10. AD6527 regroups three main subsystems connected together through a dynamic and flexible communication bus network. It also includes onboard system RAM (SRAM) and interfaces with external Flash Memory, Baseband converter functions, and terminal functions like MMI, SIM and Universal System Connector (USC).

  • Page 29: Analog Main Processor

    3. TECHNICAL BRIEF 3.6 Analog Main & Power Management Processor (AD6537B, U101) Figure 3-11. AD6537B FUNCTIONAL BLOCK DIAGRAM Service Manual /...
  • Page 30 3. TECHNICAL BRIEF AD6537B is an ADI designed Analog Baseband processor. AD6537B covers the processing • GMSK modulation interface, Aux ADC, Voice signal processing and Power Management. AD6527 consists of • 1. BB Transmit section GMSK Modulation • I-channel & Q-channel Transmit DACs and Filters •...
  • Page 31 3. TECHNICAL BRIEF 3.6.1 Analog Main & Power Management Processor (AD6537B, U101) 1. The AD6537B Baseband Transmit Section is designed to support GMSK for both single- slot and multi-slot application. 2. The transmit channel consists of a digital GMSK modulator, a matched pair of 10-bit DACs and a matched pair of reconstruction filter Figure 3-12.
  • Page 32 3. TECHNICAL BRIEF 3.6.3 Auxiliary Section 1. This section includes an Automatic Frequency Control(AFC) DAC, voltage reference buffers, an Auxiliary ADC, and light controllers. AFC DAC: 13 bits • 2. This section also contains AUX ADC and Voltage Reference IDAC: 10 bits •...
  • Page 33 4. It interconnects with external devices like main microphone, main receiver, and headset. The descriptions of audio port used in B2100 are given bellow in detail. <Up Link> -AIN1P,AIN1N : Main microphone positive/negative terminal...
  • Page 34 3. TECHNICAL BRIEF 3.6.5 Power Management Figure 3-16. AD6537B POWER MANAGEMENT SECTION 1. Power up sequence logic 1. The AD6537B controls power on sequence 2. Power on sequence - If a battery is inserted, the battery powers the 8 LDOs. - Then if PWRONKEY is detected, the LDOs output turn on.
  • Page 35 3. TECHNICAL BRIEF Figure 3-17. AD6537B POWER MODE LOGIC 2. LDO Block 1. There are 8 LDOs in the AD6537B. - VCORE : supplies Digital baseband Processor core and AD6537B digital core (1.8V, 80mA) - V M E M : supplies external memory and the interface to the external memory on the digital baseband processor (1,8V or 2.8V, 150mA) - V E X T : supplies Radio digital interface and high voltage interface (2.8V, 170mA) - V S I M : supplies the SIM interface circuitry on the digital processor and SIM card...
  • Page 36 3. TECHNICAL BRIEF 3. Battery Charging Block 1. It can be used to charge Lithium Ion and/or Nickel Metal Hydride batteries. Charger initialization, trickle charging, and Li-Ion charging control are implemented in hardware. 2. Charging Process - Check charger is inserted or not - If AD6537B detects that Charger is inserted, the CC-CV charging starts.
  • Page 37 3. TECHNICAL BRIEF Figure 3-19. B2100 HEADSET SPEAKER CIRCUIT (AD6537B) Figure 3-20. B2100 HEADSET SPEAKER CIRCUIT (AD6537B) Service Manual /...
  • Page 38 3. TECHNICAL BRIEF NORMAL CHARGING Pre-Charge Circuit Figure 3-21. CIRCUIT FOR BATTERY CHARGING AT AD6537B In order to reduce time for trickle charging, additional circuit (Pre-charge circuit) was included. This circuit has supplied Max 160mA current into the battery additionally. So call it, it reduce trickle charging time / Service Manual...

  • Page 39: Display And Interface

    3. TECHNICAL BRIEF 3.7 Display and Interface Main LCD • Properties Spec. Unit Active Screen Size 28.022(H) X 28.022(V) Color Depth 65,000 colors Resolution 128 X RGB X 128 dots Pixel Size 0.063(H) X 0.209(V) Controlled by _LCD_CS, LCD_RESET, _WR, DATA[00:15], LCD_ID, •...
  • Page 40 3. TECHNICAL BRIEF Figure 3-23. LCD INTERFACE CIRCUIT / Service Manual...

  • Page 41: Keypad Switches And Scanning

    3. TECHNICAL BRIEF 3.8 Keypad Switches and Scanning The key switches are metal domes, which make contact between two concentric pads on the keypad layer of the PCB when pressed. There are 22 switches (Normal Key 21EA, Camera side key), connected in a matrix of 5 rows by 5 columns and additional GPIO 35 for KEY_ROW5, as shown in Figure 3-24, except for the power switch (KB1), which is connected independently.

  • Page 42: Microphone

    Figure 3-28. Connection between Microphone and AD6537B 3.10 Main Speaker In the case of B2100 , there are 2 different speakers. One is main speaker for the received voice, key tone and other MIDI sounds and the other is headset speaker.

  • Page 43: Headset Interface

    3. TECHNICAL BRIEF 3.11 Headset Interface This phone chooses a 5 pin type headset which has 6 electrodes such as GND, Headset_Mic_N, Headset_Mic_P, Headset_SPK_N, JACK_DETECT, HOOK_DETECT. This type supports stereo sound. Switching from Receiver to Headset Jack If jack is inserted, JACK_DETECT goes from low to high. Audio path is switched from receiver to earphone by JACK_DETECT interrupt.

  • Page 44: Key Back-Light Illumination

    3. TECHNICAL BRIEF 3.12 Key Back-light Illumination In key back-light illumination, there are 6 Blue LEDs in Main Board, which are driven by MIDI-KEY-BL1 and MIDI-KEY-BL2 signal from ML2871. Figure 3-30. KEY BACK-LIGHT ILLUMINTION / Service Manual...

  • Page 45: Vibrator

    3. TECHNICAL BRIEF 3.13 VIBRATOR The vibrator is placed in the Bar Rear and contacted to LCD MODULE. The vibrator is driven from MIDI_VIBRATOR from ML2871. Figure 3-32. MOTOR Service Manual /...

  • Page 46: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 RX Trouble TEST POINT Figure 4-1(a) / Service Manual...
  • Page 47 4. TROUBLE SHOOTING Checking Flow Figure 4-1(a) Service Manual /...
  • Page 48 4. TROUBLE SHOOTING (1) Checking Regulator Circuit TEST POINT Figure 4-2 CIRCUIT Checking Flow / Service Manual...
  • Page 49 4. TROUBLE SHOOTING (2) Checking VCTCXO Circuit TEST POINT Checking Flow CIRCUIT Waveform Graph 4-1(a) Graph 4-1(b) Service Manual /...
  • Page 50 4. TROUBLE SHOOTING (3) Checking Ant SW & Mobile SW TEST POINT CIRCUIT Figure 4-5 Waveform ANT SW Control GSM& DCS RX Mode Graph 4-3 Table 4-2 / Service Manual...
  • Page 51 4. TROUBLE SHOOTING Checking Flow Table 4-2 Service Manual /...
  • Page 52 4. TROUBLE SHOOTING (4) Checking RX path Circuit TEST POINT CIRCUIT Checking Flow / Service Manual...
  • Page 53 4. TROUBLE SHOOTING (5) Checking RX IQ TEST POINT CIRCUIT Waveform Graph 4-4 Checking Flow Service Manual /...

  • Page 54: Tx Trouble

    4. TROUBLE SHOOTING 4.2 TX Trouble TEST POINT / Service Manual...
  • Page 55 4. TROUBLE SHOOTING Checking Flow Service Manual /...
  • Page 56 4. TROUBLE SHOOTING (1) Checking Regulator Circuit TEST POINT CIRCUIT Checking Flow / Service Manual...
  • Page 57 4. TROUBLE SHOOTING (2) Checking VCTCXO Circuit TEST POINT Checking Flow CIRCUIT Waveform Graph 4-1(a) Graph 4-1(b) Service Manual /...
  • Page 58 4. TROUBLE SHOOTING (3) Checking Ant SW & Mobile SW TEST POINT Waveform CIRCUIT Figure 4-5 Graph 4-6(a) Graph 4-6(b) / Service Manual...
  • Page 59 4. TROUBLE SHOOTING Checking Flow Table 4-3 Service Manual /...
  • Page 60 4. TROUBLE SHOOTING (4) Checking PAM Control Signal TEST POINT Checking Flow Waveform TX_RAMP PAM_EN Graph 4-7 Checking Flow Check TX-RAMP and PA-EN Check if there is Any Major Difference or not Refer to Graph 4 - 7 / Service Manual...
  • Page 61 4. TROUBLE SHOOTING (6) Checking TX IQ TEST POINT Waveform Graph 4-8 CIRCUIT Checking Flow Check if there is Any Major Difference Refer to Graph 4 -8 Service Manual /...

  • Page 62: Power On Trouble

    4. TROUBLE SHOOTING 4.3 Power On Trouble TEST POINT CIRCUIT / Service Manual...
  • Page 63 4. TROUBLE SHOOTING Checking Flow Service Manual /...

  • Page 64: Charging Trouble

    4. TROUBLE SHOOTING 4.4 Charging Trouble TEST POINT CIRCUIT / Service Manual...
  • Page 65 4. TROUBLE SHOOTING Checking Flow Service Manual /...

  • Page 66: Vibrator Trouble

    4. TROUBLE SHOOTING 4.5 Vibrator Trouble TEST POINT CIRCUIT / Service Manual...
  • Page 67 4. TROUBLE SHOOTING Checking Flow SETTING : Enter the engineering mode, and set vibrator on at vibration of BB test menu Service Manual /...

  • Page 68: Lcd Trouble

    4. TROUBLE SHOOTING 4.6 LCD Trouble TEST POINT / Service Manual...
  • Page 69 4. TROUBLE SHOOTING Checking Flow Service Manual /...

  • Page 70: Cameratrouble

    4. TROUBLE SHOOTING 4.7 Camera Trouble TEST POINT CIRCUIT DIAGRAM / Service Manual...
  • Page 71 4. TROUBLE SHOOTING Checking Flow Service Manual /...

  • Page 72: Speaker Trouble

    4. TROUBLE SHOOTING 4.8 Speaker Trouble TEST POINT CIRCUIT DIAGRAM / Service Manual...
  • Page 73 4. TROUBLE SHOOTING Checking Flow Service Manual /...

  • Page 74: Sim Card Trouble

    4. TROUBLE SHOOTING 4.9 SIM Card Interface Trouble TEST POINT CIRCUIT DIAGRAM SIM CONNECTOR / Service Manual...
  • Page 75 4. TROUBLE SHOOTING Checking Flow Service Manual /...

  • Page 76: Earphone Trouble

    4. TROUBLE SHOOTING 4.10 Earphone Trouble TEST POINT CIRCUIT DIAGRAM / Service Manual...
  • Page 77 4. TROUBLE SHOOTING Checking Flow Service Manual /...

  • Page 78: Key Backlight Trouble

    4. TROUBLE SHOOTING 4.11 KEY backlight Trouble TEST POINT / Service Manual...
  • Page 79 4. TROUBLE SHOOTING CIRCUIT DIAGRAM Checking Flow Service Manual /...

  • Page 80: Receiver Trouble

    4. TROUBLE SHOOTING 4.12 Receiver Trouble TEST POINT CIRCUIT DIAGRAM / Service Manual...
  • Page 81 4. TROUBLE SHOOTING Checking Flow SETTING : After initialize Agilent 8960, Test EGSM, DCS mode Set the property of audio as PRBS or continuous wave. Set the receiving volume of mobile as Max. Service Manual /...

  • Page 82: Microphone Trouble

    4. TROUBLE SHOOTING 4.13 Microphone Trouble TEST POINT CIRCUIT DIAGRAM / Service Manual...
  • Page 83 4. TROUBLE SHOOTING Checking Flow SETTING : After initialize Agilent 8960, Test EGSM, DCS mode Service Manual /...

  • Page 84: Rtc Trouble

    4. TROUBLE SHOOTING 4.14 RTC Trouble TEST POINT CIRCUIT DIAGRAM / Service Manual...
  • Page 85 4. TROUBLE SHOOTING Checking Flow Service Manual /...

  • Page 86: Indication Led Trouble

    4. TROUBLE SHOOTING 4.15 Indication LED Trouble TEST POINT CIRCUIT DIAGRAM / Service Manual...
  • Page 87 4. TROUBLE SHOOTING Checking Flow Indication LED only operates in trickle charging mode. Service Manual /...

  • Page 88: Download And Calibration

    5. DOWNLOAD AND CALIBRATION 5. DOWNLOAD AND CALIBRATION 5.1 Download A. Download Setup Figure 5-1 describes Download setup Figure. 5-1 Download setup / Service Manual...
  • Page 89 5. DOWNLOAD AND CALIBRATION B. Download Procedure 1. Access Flash loader program in PC and select Erase.(Don’t check OWCD) 2. Press Start and Wait until Erase is completed. Service Manual /...
  • Page 90 5. DOWNLOAD AND CALIBRATION 3. Change Address and Size(Address : 18000000, Size : 0x800000), and Press Start and Wait until Erase is completed again. 4. Press Write to start Download and press Key to choose software (AlchemyData.mot) / Service Manual...
  • Page 91 5. DOWNLOAD AND CALIBRATION 3. Change Address and Size(Address : 18000000, Size : 0x800000), and Press Start and Wait until Erase is completed again. 4. Press Write to start Download and press Key to choose software (AlchemyData.mot) Service Manual /...
  • Page 92 5. DOWNLOAD AND CALIBRATION 7. Press Start and Power on the phone using JIG remote Power on(Switch 1) 8. Wait until Sending Block is completed / Service Manual...
  • Page 93 5. DOWNLOAD AND CALIBRATION 9. Press Write to start Download and press Key to choose software(CodeData.mot) 10. Choose software Service Manual /...
  • Page 94 5. DOWNLOAD AND CALIBRATION 11. Wait until Sending Block is completed / Service Manual...

  • Page 95: Calibration

    5. DOWNLOAD AND CALIBRATION 5.2 Calibration A. Equipment List Equipment for Calibration Type / Model Band Wireless Communication Test Set HP-8960 Agilent RS-232 Cable and Test JIG RF Cable Power Supply HP-66311B Agilent GPIO interface card HP-GPIB Agilent Calibration & Final test software Test SIM Card PC (for Software Installation) Pentium class above 300MHz...
  • Page 96 5. DOWNLOAD AND CALIBRATION Figure 5-3 The top of Test JIG Power Source Description Power Source Usually 4.0V Travel Adaptor Use TA, name is TA-20G(24pin) Table 5-2 jig Power Switch Number Name Description Switch1 ADI-REMOTE In ON state, phone is awaked. It is used ADI chipset. Switch2 TI-REMOTE In ON state, phone is awaked.
  • Page 97 5. DOWNLOAD AND CALIBRATION 1. Connect as Fig 6-2(RS232 serial cable is connected between COM port of PC and MON port of TEST JIG, in general) 2. Set the Power Supply 4.0V 3. Set the 3rd, 4th of DIP SW ON state always 4.

  • Page 98: Block Diagram

    6. BLOCK DIAGRAM 6. BLOCK DIAGRAM-Base Band - 100 -...
  • Page 99 6. BLOCK DIAGRAM 6. BLOCK DIAGRAM-RF - 101 -...

  • Page 100: Circuit Diagram

    7. CIRCUIT DIAGRAM 7.1 MANI - 102 -...

  • Page 101: Audio&Midi

    7. CIRCUIT DIAGRAM 7.2 AUDIO&MIDI - 103 -...

  • Page 102: Memory&Mmi&Io

    7. CIRCUIT DIAGRAM 7.3 MEMORY&MMI&IO - 104 -...

  • Page 103: Lcd Conn

    7. CIRCUIT DIAGRAM 7.4 LCD CONN - 105 -...

  • Page 104: Rf Circuit

    7. CIRCUIT DIAGRAM 7.5 RF Circuit - 106 -...

  • Page 105: Camera

    7. CIRCUIT DIAGRAM 7.6 CAMERA - 107 -...

  • Page 106: Pcb Layout

    8. PCB LAYOUT -108 -...
  • Page 107 8. PCB LAYOUT - 109 -...

  • Page 108: Engineering Mode

    9. ENGINEERING MODE 9. ENGINEERING MODE A. About Engineering Mode Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. B. Access Codes The key sequence for switching the engineering mode on is 2945# * #. Pressing END will switch back to non-engineering mode operation.
  • Page 109 9. ENGINEERING MODE 9.1 BB Test [MENU 1] 9.1.1 Camera 1) Preview : This menu is to test Camera preview on LCD screen. 9.1.2 LCD 1) Contrast value : This menu is to change contrast value of LCD screen. 9.1.3 Backlight This menu is to test the LCD Backlight and Keypad Backlight.
  • Page 110 9. ENGINEERING MODE 9.1.4 Vibrator This menu is to test the LCD Backlight and Keypad Backlight. 1) Vibrator on : Vibration mode is on. 2) Vibrator off : Vibration mode is off. 9.1.5 ADC (Analog to Digital Converter) This displays the value of each ADC. 1) MVBAT ADC : Main Voltage Battery ADC 2) AUX ADC : Auxiliary ADC 3) TEMPER ADC : Temperature ADC...

  • Page 111: Rf Test [Menu 2]

    9. ENGINEERING MODE 9.1.7 Audio This is a menu for setting the control register of Voiceband Baseband Codec chip. Although the actual value can be written over, it returns to default value after switching off and on the phone. 1) VbControl1 : VbControl1 bit Register Value Setting 2) VbControl2 : VbControl2 bit Register Value Setting 3) VbControl3 : VbControl3 bit Register Value Setting 4) VbControl4 : VbControl4 bit Register Value Setting...

  • Page 112: Mf Mode [Menu 3]

    9. ENGINEERING MODE 9.3 MF mode [MENU 3] This manufacturing mode is designed to do the baseband test automatically. Selecting this menu will process the test automatically, and phone displays the previous menu after completing the test. 9.3.1 All auto test LCD, Backlight, Vibrator, Buzzer, Key Pad, Mic&Speaker, 9.3.2 Backlight LCD Backlight is on for about 1.5 seconds at the same time, then off.

  • Page 113: Trace Option [Menu 4]

    9. ENGINEERING MODE 9.4 Trace option [MENU 4] This is NOT a necessary menu to be used by neither engineers nor users. 9.5 Call timer [MENU 5] This menu is to set the Digital Audio Interface Mode for Speech Transcoder and Acoustic testing. 1) All calls : This displays total conversation time.

  • Page 114: Stand Alone Test

    10. STAND ALONE TEST 10. STAND ALONE TEST 10.1 Introduction This manual explains how to examine the status of RX and TX of the model. A. Tx Test TX test - this is to see if the transmitter of the phones is activating normally. B.

  • Page 115: Means Of Test

    10. STAND ALONE TEST 10.3 Means of Test a. Select a COM port b. Set the values in Tx or Rx c. Select band and channel d. After setting them all above, press connect button. e. Press the start button Figure.
  • Page 116 10. STAND ALONE TEST Figure 11-2. HW test setting Figure 11-3. Ramping profile / Service Manual...

  • Page 117: Auto Calibration

    11.AUTO CALIBRATION 11. AUTO CALIBRATION 11.1 Overview Autocal (Auto Calibration) is the PC side Calibration tool that perform Tx ,Rx and Battery Calibration with Agilent 8960(GSM call setting instrument) and Tektronix PS2521G(Programmable Power supply). Autocal generate calibration data by communicating with phone and measuring equipment then write it into calibration data block of flash memory in GSM phone.
  • Page 118 11.AUTO CALIBRATION Figure 11-1. Auto Calibration Program Screen Cable loss : Enter the RF cable loss GSM and DCS Screen GPIB(Primary address) : Enter the SS(Ag8960) and PS(Tektronix PS2521G) GPIB address Screen ADC Channel : Default ADC Calibration Channel Screen Auto Calibration Item : Default Calibration Settings about Tx, Rx, ADC and write BIN file / Service Manual...

  • Page 119: Agc

    11.AUTO CALIBRATION 11.4 AGC This procedure is for Rx calibration. In this procedure, We can get RSSI correction value. Set band EGSM and press Start button the result window will show correction values per every power level and gain code and the same measure is performed per every frequency.
  • Page 120 12. EXPLODED VIEW & REPLACEMENT PART LIST 12.1 Exploded View - 123 -...

  • Page 121: Exploded View & Replacement Part List

    12.EXPLODED VIEW & REPLACEMENT PART LIST 12.2 Replacement Parts Note: This Chapter is used for reference, Part order <Mechanical Component> is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark GSM,BAR/FILP TGSM0034701 AAAY00 ADDITION AAAY0092101 Silver APEY PHONE...
  • Page 122 12.EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MLAK LABEL,MODEL MLAK0013603 MPBT00 PAD,CAMERA MPBT0012701 Black MPBZ00 MPBZ0080601 Blue MPBZ01 MPBZ0080901 Black MTAC00 TAPE,SHIELD MTAC0022101 Gold MTAC01 TAPE,SHIELD MTAC0022201 Gold MTAZ00 TAPE MTAZ0065101 ADCA00 DOME ASSY,METAL ADCA0028801 AMCY00 MIKE ASSY...

  • Page 123: Replacement Parts

    12.EXPLODED VIEW & REPLACEMENT PART LIST Note: This Chapter is used for reference, Part order 12.2 Replacement Parts is ordered by SBOM standard on GCSC <Main component> Location Level Description Part Number Specification Color Remark SUSY00 SPEAKER SUSY0014801 PIN ,8 ohm,88 dB,20 mm,*14mm SJMY00 VIBRATOR,MOTOR SJMY0007001...
  • Page 124 12.EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C131 CAP,CERAMIC,CHIP ECCH0000113 18 pF,50V,J,NP0,TC,1005,R/TP C133 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C134 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C135 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C136 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP...
  • Page 125 12.EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C302 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C303 CAP,CERAMIC,CHIP ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP C304 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C305 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C306 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP...
  • Page 126 12.EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C519 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP C520 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP C521 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP C522 CAP,CERAMIC,CHIP ECCH0000103 1.5 pF,50V,C,NP0,TC,1005,R/TP C523 CAP,CERAMIC,CHIP ECCH0000103 1.5 pF,50V,C,NP0,TC,1005,R/TP C524 CAP,CERAMIC,CHIP ECCH0000102 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP...
  • Page 127 12.EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark FL402 FILTER,EMI/POWER SFEY0006401 SMD ,6 Channel, EMI+ESD, CSP 900.1800 ,1900 ,3.0 dB,3.8 dB,25 dB,23 dB,ETC , FL500 FILTER,SEPERATOR SFAY0003802 7.2*5.0*1.8mm FL600 FILTER,EMI/POWER SFEY0009301 SMD , FL601 FILTER,EMI/POWER SFEY0009301 SMD ,...
  • Page 128 12.EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R213 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R215 RES,CHIP ERHY0000296 1M ohm,1/16W,J,1005,R/TP R216 RES,CHIP ERHY0000244 1.5K ohm,1/16W,J,1005,R/TP R217 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R218 RES,CHIP ERHY0000203 10 ohm,1/16W,J,1005,R/TP R219 RES,CHIP ERHY0000203 10 ohm,1/16W,J,1005,R/TP...
  • Page 129 12.EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R334 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R335 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R336 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R337 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R338 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R339 RES,CHIP ERHY0000265 20K ohm,1/16W,J,1005,R/TP...
  • Page 130 12.EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R608 RES,CHIP ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP R609 RES,CHIP ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP R610 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R611 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP SW500 CONN,RF SWITCH ENWY0003001 STRAIGHT ,SMD ,0.6 dB,3.8X3.0X3.6T SW501 SWITCH,TACT ESCY0002501...
  • Page 131 12.EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark VA311 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA312 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA313 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA314 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR VA350...
  • Page 132 PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR VA401 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR SPFY PCB,MAIN SPFY0097501 FR-4 ,1.0 mm,BUILD-UP 8 ,B2100 MAIN PCB SNGF00 ANTENNA,GSM,FIXED SNGF0006402 3.0 ,-2.0 dBd, ,EGSM+DCS+PCS, Intenna Service Manual /...

  • Page 133: Accessory

    Note: This Chapter is used for reference, Part order by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark WSAY00 SOFTWARE,APPLICATION WSAY0016801 B2100 SOFTWARE,APPLICATION for Australia Optus B2100P40FL-61-V100-505-02 MAR 29 2005@ B2100 WSYY00 SOFTWARE WSYY0222601 Austailia Optus / Service Manual...

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